ATS-19C-207-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19C-207-C1-R0-ND

Manufacturer Part#:

ATS-19C-207-C1-R0

Price: $ 3.83
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X12MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19C-207-C1-R0 datasheetATS-19C-207-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.48453
30 +: $ 3.39024
50 +: $ 3.20191
100 +: $ 3.01354
250 +: $ 2.82517
500 +: $ 2.73100
1000 +: $ 2.44848
Stock 1000Can Ship Immediately
$ 3.83
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.37°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-19C-207-C1-R0 is a type of thermal heat sink used for temperature regulation in electronic systems. It is designed to efficiently dissipate heat released by electronic components, such as processors, microcontrollers, and memory chips, in order to prevent over-temperature conditions that can damage or degrade these components. The ATS-19C-207-C1-R0 is used in many industrial, commercial, and residential applications, and is a reliable and cost-effective solution for temperature regulation.

The main function of a heat sink is to direct thermal energy away from a semiconductor chip or other source in order to maintain safe operating temperatures. ATS-19C-207-C1-R0 has a robust aluminum housing that is constructed using precision CNC machining for increased durability. The heat sink also has a patented two-phase design to maximize the rate of thermal energy dissipation while reducing overall heat accumulation.

The ATS-19C-207-C1-R0 uses forced convection to quickly and efficiently disperse heat. Air is attracted to the heat sink housing by a fan located on the bottom side of the unit. The fan draws in ambient air which is then circulated over the heat sink fins. As the air passes over the fins, it absorbs the heat energy and carries it away from the heat sink, thus reducing the temperature of the electronic component.

In order to ensure maximum thermal dissipation, the fins on the ATS-19C-207-C1-R0 are designed with a highly efficient air-flow pattern. The fins are configured in a cross-flow pattern with the fins on one side facing up and the fins on the opposite side facing down. This allows air to pass over the upper and lower surfaces of the fins, thus ensuring that the maximum amount of surface area is exposed to the air flow.

The ATS-19C-207-C1-R0 is an excellent choice for temperature regulation in many different types of applications. It is a reliable and cost-effective solution for industrial, commercial, and residential applications. The two-phase design of the heat sink ensures maximum thermal energy dissipation, and forced convection ensures that air is circulated over the entire surface area of the fins for maximum efficiency. With its robust aluminum housing and efficient design, the ATS-19C-207-C1-R0 is an excellent choice for temperature regulation.

The specific data is subject to PDF, and the above content is for reference

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