ATS-19C-208-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.236" (6.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.56°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - heat sinks are one of the most valuable components used in a variety of applications such as industrial automation and energy management. ATS-19C-208-C3-R0 is a thermal-heat sink with a high thermal conductivity and a low thermal resistance that helps dissipate heat from high-power components in thermal critical applications. This thermal-heat sink provides a cost-effective solution to the thermal management of industrial systems.

Application Field

ATS-19C-208-C3-R0 thermal-heat sink is designed to keep the temperature of the component cool, which is beneficial in many industrial applications. It is used to dissipate heat from high-power components such as processors and power supplies in industrial control systems. It is also used in LED lighting, automotive, HVAC, communication, photovoltaic, aerospace and defense industries as well as medical or laboratory equipment. This thermal-heat sink is also suitable for medical and laboratory applications where a high level of protection against thermal damage is required.

Working Principle

The ATS-19C-208-C3-R0 thermal-heat sink is designed to provide a cost-effective solution for controlling thermal processes. The thermal-heat sink uses a combination of convection and thermal radiation to mitigate the temperature of the components. Its high thermal conductivity and low thermal resistance allow it to quickly dissipate heat from the component, thereby improving the temperature of the system.In addition, the thermal-heat sink is designed with a honeycomb structure that helps distribute air evenly around the components. As the air passes through the honeycomb grid, it absorbs heat from the components, which then dissipates to the environment. This honeycomb design also helps to reduce the noise generated by the components, thus improving the overall efficiency of the system.

Conclusion

The ATS-19C-208-C3-R0 thermal-heat sink is an ideal thermal solution for any system in need of superior thermal performance. It provides high efficiency and is designed to dissipate heat from high-power components. This thermal-heat sink offers cost-effective and reliable thermal management for industrial applications. With its efficient heat dissipation and improved noise levels, this thermal-heat sink ensures that components working in thermal-critical applications are kept cool with minimal energy consumption.

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