| Allicdata Part #: | ATS-19C-209-C1-R0-ND |
| Manufacturer Part#: |
ATS-19C-209-C1-R0 |
| Price: | $ 5.07 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-209-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.55868 |
| 30 +: | $ 4.30521 |
| 50 +: | $ 4.05191 |
| 100 +: | $ 3.79871 |
| 250 +: | $ 3.54546 |
| 500 +: | $ 3.29222 |
| 1000 +: | $ 3.22890 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays a critical role in the performance and lifespan of electronics, and choosing the right heat sink for the application is essential. The ATS-19C-209-C1-R0 heat sink is specifically designed for high heat dissipation and is well-suited for a variety of applications. This article will discuss the ATS-19C-209-C1-R0 heat sink\'s application field and working principle.
A heat sink is a device used to reduce the temperature of an electronic component or system. They are often used to cool CPUs, GPUs, and other types of processors. Heat sinks are also used to dissipate heat in power supplies, LED lighting systems, and other components and devices. The ATS-19C-209-C1-R0 is designed to move heat away from a component or system quickly and efficiently. It is constructed of high-performance aluminum and features a broad fin design that allows for the maximum amount of heat dissipation.
The ATS-19C-209-C1-R0 is designed for use in applications where it needs to dissipate high amounts of heat. It is ideal for use in high-end gaming PCs, servers, and other computing hardware. It can also be used in telecommunication equipment such as cell phones and in embedded applications. The heat sink can also be used in LED lighting systems, power electronic components, and other devices that require efficient heat dissipation.
The ATS-19C-209-C1-R0 heat sink utilizes an advanced heat exchange mechanism to efficiently dissipate heat. It features an innovative thermal transfer system that creates a high-intensity, low-resistance heat transfer path. The heat transfer path helps the device to dissipate heat faster than traditional fins. The fin design of the ATS-19C-209-C1-R0 also allows for efficient cooling. The heat sink is designed with a patented "W-air flow" air convection pattern to reduce turbulence and create a more efficient heat exchange. This helps to ensure the highest level of performance and increase the lifespan of the device.
The ATS-19C-209-C1-R0 heat sink is designed with a "Direct Contact" base that features flat top ridges. The ridges aid in the heat transfer process by creating a larger physical contact area for the heat to sink into the fins. The base is designed with special grooves to allow the heat to quickly escape away from the device.
The ATS-19C-209-C1-R0 is a reliable and efficient heat sink for a variety of applications. It is designed from high-grade materials for long-term operation and high-performance results. Its innovative design helps to ensure that the device reaches optimal performance and that its lifespan is extended. The ATS-19C-209-C1-R0 is a reliable and efficient solution for electronics and other applications that require efficient heat dissipation.
The specific data is subject to PDF, and the above content is for reference