ATS-19C-23-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.06°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionThe ATS-19C-23-C3-R0 is a thermal management solution that is designed to move heat away from hot spots. Heat is conducted by the aluminum body of the device and moves away by a fan, providing a cooling system that effectively keeps the system within the working temperature range. This product offers a wide range of applications and can be used in a variety of different fields. Application FieldsThe most common application of the ATS-19C-23-C3- R0 is for laptops and notebooks. With increasing demands on laptop processors, the need for a cooling solution has become more and more necessary. The ATS-19C-23-C3-R0 is able to offer effective thermal solutions for this type of application.The ATS-19C-23-C3-R0 can also be used in automotive and industrial applications. In these applications, the device can help to reduce the temperatures surrounding components and protect them from potential damage caused by overheating. The device is reliable and highly efficient, making it ideal for these application environments.The device can also be used for medical applications, where accurate temperature control is critical to ensure patient safety. The device is very reliable and offers excellent performance for applications where maintaining a constant and safe temperature is essential for proper operation.Working PrincipleThe ATS-19C-23-C3-R0 uses the principle of heat conduction and convection to move heat away from components. Heat is conducted by the aluminum body of the device and is moved away by a fan. The fan can be adjusted to varying speeds to ensure effective cooling.The design of the device also incorporates two layers. The first layer is an insulating material that helps to reduce unnecessary heat transfer. This layer is then followed by a mesh layer that helps to promote air convection and improve the overall performance of the device.The device also uses a strong base, which helps to optimize air convection and improve cooling efficiency. This helps to reduce the need for additional cooling mechanisms and allows the device to reach effective temperatures quickly and efficiently.ConclusionThe ATS-19C-23-C3-R0 is a highly efficient thermal solution designed for a wide range of applications. It is designed to move heat away from components and keep them within an effective temperature range. The device uses a strong base and two layers of insulation and mesh to promote effective air convection. This helps to optimize air convection and ensure effective cooling. The device can be used for laptops and notebooks, automotive and industrial applications, and medical applications.

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