ATS-19C-24-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19C-24-C1-R0-ND

Manufacturer Part#:

ATS-19C-24-C1-R0

Price: $ 4.54
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19C-24-C1-R0 datasheetATS-19C-24-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.08303
30 +: $ 3.85623
50 +: $ 3.62943
100 +: $ 3.40257
250 +: $ 3.17573
500 +: $ 2.94889
1000 +: $ 2.89218
Stock 1000Can Ship Immediately
$ 4.54
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.36°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-19C-24-C1-R0 heat sink is a kind of thermal management system used to dissipate heat away or conduct the generated heat out of a device or system. It is designed to protect important components of the system from overheating which can cause permanent damage, and to increase overall system performance and energy efficiency by managing the temperature. Heat sinks range from simple, flat metal strips to complex assemblies with a combination of materials like aluminum, copper, and steel.

The ATS-19C-24-C1-R0 heat sink is a 2U enclosure with an all-metal fin-stack design, featuring 19 large fins in an array of orientations and configurations. It is optimized for convection cooling in a contact-limited environment. With its use of premium quality aluminum, it ensures superior heat dissipation and heat conduction properties.

The ATS-19C-24-C1-R0 heat sink is ideal for use in applications where maximum cooling performance and energy efficiency is required. It is commonly used in applications such as electronics cooling, computer chipsets, semiconductors, graphic chips, game consoles, and many other industrial devices. For instance, high-performance computers may require cooling solutions to cope with the large amount of heat generated by the components contained within.

The main working principle of a ATS-19C-24-C1-R0 heat sink is to effectively transfer heat away from its source. This is achieved by providing a large fin surface area which has multiple paths through which air can flow. The fins create turbulence as the air passes through, maximizing the rate of heat transfer away from the source. The fin also increases the surface area which gives the air more area to transfer heat away. Heat transfer is also improved by the addition of a fan which forces the air across the fins, creating a wider web of turbulence and increasing the cooling efficiency.

In addition to its benefits in heat dissipation, the ATS-19C-24-C1-R0 heat sink also offers other advantages such as lower noise levels, even temperature distribution, and a smaller sized footprint. Its all-metal construction makes it more durable and capable of withstanding tighter fitting when mounting. All of these features make it a great choice for applications that need superior cooling performance and energy efficiency at an affordable cost.

Overall, the ATS-19C-24-C1-R0 heat sink is a great choice for applications that require high performance cooling and energy efficiency. Its well-designed fin stack provides maximum heat dissipation with minimal noise, while its all-metal construction ensures maximum durability. Its capability to be used in tight space and its relatively low cost makes it a great option for engineers and businesses looking for a reliable and efficient cooling solution for their devices.

The specific data is subject to PDF, and the above content is for reference

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