| Allicdata Part #: | ATS-19C-24-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-24-C3-R0 |
| Price: | $ 5.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-24-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.81068 |
| 30 +: | $ 4.54314 |
| 50 +: | $ 4.27594 |
| 100 +: | $ 4.00869 |
| 250 +: | $ 3.74144 |
| 500 +: | $ 3.47420 |
| 1000 +: | $ 3.40738 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.43°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in many electronic applications, and heat sinks can help improve the performance and life of these components. The ATS-19C-24-C3-R0 is designed to provide effective cooling for electronics, and this article will discuss its application field and working principle.
This ATS-19C-24-C3-R0 heat sink is a high performance two-piece device designed to provide efficient cooling for applications with requirements up to 100 watts. The base is a black anodized aluminum and the fins are soldered brazing alloy. The device includes seven distinct fins, with the innermost having larger and more curvature compared to the outer. The beveled design and special orientation of the fins provide an oppositional effect that helps to improve passive heat dissipation while reducing turbulence.
The application field of the ATS-19C-24-C3-R0 is very broad. It is ideal for use in high current applications, where the use of traditional fan-based cooling systems may not be feasible or desirable. It is especially applicable to microprocessors, power transistors, MEMS, high powered semiconductors, LEDs, and other similar components. The device can also be used in high density applications, where space is at a premium, since it has been designed to fit in very narrow spaces.
The working principle of the ATS-19C-24-C3-R0 is also relatively straightforward. The device works by dissipating heat into the air in order to keep the temperature of the components within an acceptable range. This is done through convection, as the device utilizes the natural circulation of air to transfer heat away from the components and to the surrounding environment. The aluminum base acts as a conductor, transferring heat away from the components, while the finned design of the device further improves heat dissipation.
Overall, the ATS-19C-24-C3-R0 is a highly effective thermal management device that can provide robust cooling for a wide variety of electronic components. Through its finned design and convection, it is able to effectively dissipate heat from the components and ensure their optimal performance. The device is well suited to high current applications in which fan-based cooling systems may not be feasible or desirable, as well as applications that require efficient cooling within a limited space. As such, it is an excellent choice for many thermal management applications.
The specific data is subject to PDF, and the above content is for reference