ATS-19C-27-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.23°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-19C-27-C1-R0 Thermal - Heat Sinks Application Field and Working Principle

Thermal - Heat Sinks are essential components in high performance computers, industrial machinery, optics, and medical equipment, effectively protecting sensitive components from thermal and mechanical wear. Among them, ATS-19C-27-C1-R0 is a high performance, efficient Heat Sink designed for high performance applications. This article will discuss the application field and working principle of ATS-19C-27-C1-R0 thermal - Heat Sink.

Application Field of ATS-19C-27-C1-R0 Thermal - Heat Sink

ATS-19C-27-C1-R0 thermal - Heat Sink is widely used in a variety of applications. It is very suitable for cooling of high-end industrial equipment, including precision optical equipment and heavy-duty machinery. It is also suitable for cooling of medical equipment, including high-end medical imaging equipment. Furthermore, ATS-19C-27-C1-R0 thermal - Heat Sink is suitable for cooling of high-performance computers, such as video cards and motherboards.

Working Principle of ATS-19C-27-C1-R0 Thermal - Heat Sink

The working principle of ATS-19C-27-C1-R0 thermal - Heat Sink is relatively simple and straightforward. It is a passive heat dissipation device, which can effectively dissipate the heat from the operating components to the ambient environment. It consists of a metal plate with cooling fins on the side, and a base with an integrated copper core. Heat from the operating component is first transferred through the thermal interface material onto the copper plate, then is heat dissipated through the fins into the surrounding environment. The metal plate and base can also act as a heatsink for the operating component.ATS-19C-27-C1-R0 thermal - Heat Sink utilizes advanced thermal technologies such as direct heat pipe technology to achieve extremely efficient heat dissipation. This thermal technology enables the heat sink to perform at its optimal working temperature even when the operating component is exposed to high temperatures for long periods of time. It also helps to reduce the noise and vibration caused by heat dissipation from the operating component.

Advantages of ATS-19C-27-C1-R0 Thermal - Heat Sink

ATS-19C-27-C1-R0 thermal - Heat Sink has several advantages over traditional heat sinks. Firstly, it has an extremely efficient thermal capacity due to its advanced thermal technologies. This ensures that the operating component remains at its optimal working temperature, even when the surrounding environment is extremely hot. Secondly, ATS-19C-27-C1-R0 thermal - Heat Sink is extremely lightweight compared to traditional heat sinks, making it ideal for applications where weight is an issue. Finally, it provides excellent durability and reliability, even in high temperature and vibration environments.In conclusion, ATS-19C-27-C1-R0 thermal - Heat Sink is an advanced, efficient, and reliable thermal solution for cooling of high-end industrial, medical and computer components. It utilizes advanced thermal technologies to handle high temperature and vibration environments, providing excellent protection for sensitive components. Furthermore, its lightweight design ensures that it can be incorporated into a variety of applications with minimal impact to the overall system weight. Therefore, ATS-19C-27-C1-R0 thermal - Heat Sink is an ideal choice for consumers seeking an efficient, reliable, and lightweight thermal solution.

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