| Allicdata Part #: | ATS31686-ND |
| Manufacturer Part#: |
ATS-19C-27-C2-R0 |
| Price: | $ 7.71 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-27-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.94260 |
| 10 +: | $ 6.75486 |
| 25 +: | $ 6.37963 |
| 50 +: | $ 6.00440 |
| 100 +: | $ 5.62918 |
| 250 +: | $ 5.25390 |
| 500 +: | $ 4.87862 |
| 1000 +: | $ 4.78480 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are integral parts of any electronic systems, and the ATS-19C-27-C2-R0 heat sink is one of the most popular options for operations requiring efficient cooling. This heat sink is designed for use in electronic components with continuous operation up to the 260°C (500°C) range, which means it is well suited for applications such as laser cooling, optical instrumentation, LED cooling, and high-temperature electronics. Its construction includes a base metal substrate material that provides excellent thermal conductivity and mechanical strength, and a series of heat-dissipating fins connected to the base by a soldered interface.
The ATS-19C-27-C2-R0 heat sink operates by dissipating heat from an electronic component into a large surface area of the heat sink. The fins of the heat sink contain a large number of channels that draw heat away from the electronic component. As air passes through the channels, the heat is dissipated into the atmosphere, allowing the electronic component to remain cool. This heat dissipation process is further aided by the design of the fins, which have a larger surface area than the electronic component itself, allowing for maximum cooling efficiency.
The base of the ATS-19C-27-C2-R0 heat sink is also designed to reduce thermal resistance, allowing it to function more efficiently. The base features an N-type thermal interface material (TIM) that provides a tight connection between the component and the heat sink. This ensures that all of the heat from the component is conducted into the sink, resulting in improved cooling performance. Additionally, the base is constructed from a metal alloy with excellent thermal conductivity, which also helps to improve thermal performance.
The ATS-19C-27-C2-R0 heat sink is extremely lightweight and versatile, making it ideal for multiple applications in a variety of different industries. It can be used for both applications where continuous operation in the 260°C (500°C) range is required, as well as for those where more conservative thermal management is sufficient. With its excellent thermal conductivity and efficient cooling capabilities, the ATS-19C-27-C2-R0 heat sink is able to provide high-performance cooling in any environment.
The specific data is subject to PDF, and the above content is for reference