| Allicdata Part #: | ATS-19C-33-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-33-C3-R0 |
| Price: | $ 5.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-33-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.18868 |
| 30 +: | $ 4.90014 |
| 50 +: | $ 4.61185 |
| 100 +: | $ 4.32369 |
| 250 +: | $ 4.03543 |
| 500 +: | $ 3.74718 |
| 1000 +: | $ 3.67511 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
ATS-19C-33-C3-R0 is a heat sink, widely used in a wide range of applications, and is designed to provide effective thermal management for various electronic components, such as SoC and processors. It is composed of a low thermal resistance aluminum plate with a built-in thermoelectric cooling device.
The thermal resistance of ATS-19C-33-C3-R0 is low—meaning the heat dissipates quickly and effectively from inside components. This is achieved by the aluminum plate which absorbs heat and dissipates it to the atmosphere via the thermoelectric device. Additionally, the device also helps to provide cooling to components by adjusting the electric current necessary to dissipate the heat from the components.
The ATS-19C-33-C3-R0 offers several advantages to electronics engineers. It is easy to use due to its plug-and-play design; all it requires is an AC power source. Additionally, its efficient thermal management helps to maximize performance of heat-sensitive devices. It is also designed to be applied in both stationary and mobile user-environments, so it can be used in almost any system.
Due to its thermoelectric cooling device, the ATS-19C-33-C3-R0 operates on the principle of the Peltier effect. In this effect, when a current passes through two dissimilar metals, also known as semiconductors, one side of the metal plate becomes cold while the other side becomes hot. The temperature differential is regulated by the movement of electrons, with the electric current helping to transfer heat from one side to the other.
The thermal resistance and the thermal conduction of the device is also low, meaning the ATS-19C-33-C3-R0 is a very efficient cooling solution for different types of electronic components. Thanks to its high thermal efficiency, it can help to reduce energy consumption as well as reduce heat load from components, resulting in improved system performance.
ATS-19C-33-C3-R0 heat sinks are a popular choice for electronics engineers worldwide due to their wide range of applications and efficient thermal management capabilities. As a result, this thermal solution is becoming increasingly more popular in many areas of the consumer electronics industry.
The specific data is subject to PDF, and the above content is for reference