ATS-19C-34-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	1.450" (36.83mm)
Diameter:	--
Height Off Base (Height of Fin):	0.900" (22.86mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.33°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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The ATS-19C-34-C2-R0 is a thermal-heat sink, designed to dissipate heat from electronic components. Its size and design make it ideal for applications where space is at a premium.The ATS-19C-34-C2-R0 heat sink has a number of unique design features that make it especially effective at dissipating heat. The first is its high-efficiency heat sink design. The sink is designed so that airflow from its fans creates a vacuum effect that pulls the heat away from the chips being cooled. This makes it extremely efficient at taking the heat away from the chips, allowing them to operate at peak efficiency.The ATS-19C-34-C2-R0 also has a low thermal impedance, meaning that it can transfer heat quickly and efficiently. This reduces the risk of overheating the chips and components. The sink also features a high-temperature tolerance—up to 192DegC—which allows it to run at high temperatures without risking damage to the components.The ATS-19C-34-C2-R0 also features a large fin area, which increases the surface area of the heat sink. This larger surface area means that it can dissipate more heat faster. In addition, the sink’s fins are designed to create turbulence at the air-flow region, reducing air resistance and increasing the airflow.Finally, the ATS-19C-34-C2-R0 features a completely anodized finish, protecting it from corrosion and providing greater resistance to oxidation. This protective finish also helps the heat sink to maintain its original luster, giving it a longer life and improved performance.The ATS-19C-34-C2-R0 thermal-heat sink is perfect for electronic and computing applications, including computing systems, laptop computers, embedded systems, and a range of other applications. Its high-efficiency design, low thermal impedance, and large fin area make it ideal for dissipating heat from chips and components, while its anodized finish helps to protect the heat sink from corrosion and oxidation, and extend its service life.

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