ATS-19C-36-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS-19C-36-C2-R0-ND

Manufacturer Part#:

ATS-19C-36-C2-R0

Price: $ 5.77
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X11.43MM T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19C-36-C2-R0 datasheetATS-19C-36-C2-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.18868
30 +: $ 4.90014
50 +: $ 4.61185
100 +: $ 4.32369
250 +: $ 4.03543
500 +: $ 3.74718
1000 +: $ 3.67511
Stock 1000Can Ship Immediately
$ 5.77
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.82°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are an essential part of modernday electronics. The ATS-19C-36-C2-R0 is a thermal - heat sink that is designed for applications involving high frequency and high current operation.

The ATS-19C-36-C2-R0 has a thermal resistance of 0.45 degree Celsius per watt and a thermal conductivity of 3.12 W/m-K. This combination of properties makes it suitable for applications in which power dissipation needs to be minimized. The surface area allows for efficient dissipation of heat, and the fins are designed to promote convective cooling. The aluminum-oxide frame acts as a heat spreader to absorb heat from the fins.

The ATS-19C-36-C2-R0 can be used in a variety of applications. It can be mounted on a flat surface and can be used in air or liquid-cooled environments. It is suited for applications where the area to be thermally managed is small. Examples include power supplies, power regulators, heat exchangers, and microelectronics.

The ATS-19C-36-C2-R0 works by transferring the heat from the component to the thermal heat sink where it is dissipated into the ambient air. The thermal impedance of the thermal heat sink is lower than the thermal impedance of the component. This helps reduce the thermal load on the component, thereby improving the component\'s reliability and performance.

Thermal - Heat Sinks are an important component of any electronics system. The ATS-19C-36-C2-R0 provides an effective and reliable solution for applications in which thermal management is critical. The low thermal resistance and high thermal conductivity make it an ideal choice for applications where power and temperature are of concern.

The specific data is subject to PDF, and the above content is for reference

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