| Allicdata Part #: | ATS-19C-50-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-50-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-50-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19032 |
| 30 +: | $ 3.10380 |
| 50 +: | $ 2.93139 |
| 100 +: | $ 2.75902 |
| 250 +: | $ 2.58656 |
| 500 +: | $ 2.50034 |
| 1000 +: | $ 2.24169 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
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Thermal - Heat Sinks: ATS-19C-50-C3-R0 Application Field and Working Principle
The ATS-19C-50-C3-R0 is a heat sink type of thermal solution. The product has been designed for use in a variety of applications, such as audiovisual equipment, information technology systems, and telecommunications networks.Purpose of a Heat Sink
A heat sink is designed to absorb and dissipate heat away from an electronic component or device. Heat sinks are necessary to keep sensitive components from overheating and damaging them. The ATS-19C-50-C3-R0 is a thermal solution for dissipating heat away from any electronic component where thermal protection is required.Application Fields for ATS-19C-50-C3-R0
The ATS-19C-50-C3-R0 is suitable for a variety of applications, including audiovisual equipment, information technology systems, and telecommunications networks. The product has been tested for thermal protection of components in ambient temperatures from -20℃ to 80℃.ATS-19C-50-C3-R0 Heat Sink Structure
The ATS-19C-50-C3-R0 is a high-performance heat sink with a unique design. It is constructed from an aluminum heat sink with a copper base. The construction enables the heat sink to efficiently and effectively dissipate heat away from the component, preventing it from overheating and damaging it.Working Principle of ATS-19C-50-C3-R0
The ATS-19C-50-C3-R0 operates on the principle of physical conduction. Heat is transferred from the electronic components to the heat sink’s copper base, and then dissipated away from the components through the aluminum heat sink.When the heat sink is used in applications where ambient temperatures are below 0℃, a thermal grease should be applied between the heat sink and the component to ensure good thermal performance.Conclusion
The ATS-19C-50-C3-R0 is a high-performance heat sink designed for use in a variety of applications, including audiovisual equipment, information technology systems, and telecommunications networks. The aluminum heat sink and copper base combination makes it an effective thermal solution for dissipating heat away from the components. The product has been tested for thermal protection of electronic components in ambient temperatures from -20℃ to 80℃.The specific data is subject to PDF, and the above content is for reference
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