| Allicdata Part #: | ATS-19C-53-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-53-C3-R0 |
| Price: | $ 3.96 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-53-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.59667 |
| 30 +: | $ 3.39654 |
| 50 +: | $ 3.19675 |
| 100 +: | $ 2.99697 |
| 250 +: | $ 2.79717 |
| 500 +: | $ 2.59738 |
| 1000 +: | $ 2.54743 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.76°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks have been present in society for many years and have become increasingly used in recent years. Most thermal management applications rely heavily on their performance, so the availability of high quality products is of utmost importance. The ATS-19C-53-C3-R0 Heat Sink is used in many thermal management applications, and can be employed to reduce system temperature and associated thermal management costs.
The ATS-19C-53-C3-R0 Heat Sink is a thermoelectric cooler designed for high current density applications. It is constructed of high quality aluminum and has a highly efficient thermal conductivity of 0.45 W/m•K. The heat sink also has a large number of fins that enable the stack to transfer heat more efficiently. The fins and the base are connected via a vented structure, which helps reduce unwanted hot spots. It also has a low profile design, which is suitable for many space-constrained applications. In addition, it has a low operating noise, making it suitable for quiet environments such as offices and classrooms.
The ATS-19C-53-C3-R0 Heat Sink has a wide range of applications in the thermal management industry. It is commonly used in electronics, medical, automotive, and aerospace industries. It is also used in many computer systems for cooling the CPU and other components. This heat sink is often used in embedded systems, such as those found in smartphones, tablets, and other mobile devices. Additionally, it is used in industrial process control applications that require reliable cooling for high-temperature components.
The ATS-19C-53-C3-R0 Heat Sink works by using the Peltier Effect. This effect occurs when a current is applied to the two sides of the heat sink which causes a temperature difference. The heat that is generated on one side is transferred to the other side where it is dissipated. By using high-efficiency fans, the heat sink is able to dissipate heat quickly and efficiently. The heat sink also uses a unique design which allows air to flow around the sheet metal fins, further reducing hot spots and increasing the overall effectiveness of the heat sink.
The ATS-19C-53-C3-R0 Heat Sink has become a widely used and accepted product in the thermal management industry and is a viable solution for high-density applications. It is an effective way to reduce system temperatures and overall thermal management costs. It is also a good choice for those who are looking for a reliable and efficient way to manage heat in an environment where space is at a premium. With its low noise operation, it is ideal for use in offices, classrooms, and any other quiet environment.
The specific data is subject to PDF, and the above content is for reference