| Allicdata Part #: | ATS-19C-55-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-55-C3-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-55-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28419 |
| 30 +: | $ 3.19557 |
| 50 +: | $ 3.01795 |
| 100 +: | $ 2.84042 |
| 250 +: | $ 2.66291 |
| 500 +: | $ 2.57415 |
| 1000 +: | $ 2.30786 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 24.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
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Thermal-heat sinks are an important component in the modern construction of electronic systems. The ATS-19C-55-C3-R0 thermal-heat sink is a robust and efficient heat dissipation device designed for use in a variety of applications, including high-end gaming computers, power supplies, and industrial/automotive engine cooling systems. The ATS-19C-55-C3-R0 can provide an effective solution for dissipating generated heat from high-heat-producing sources in both air and liquid-cooled systems.This thermal-heat sink is constructed from lightweight aluminum alloy and is equipped with a thick copper plane that helps to transfer heat away from the source more quickly than comparable products. The thermal-heat sink features an air- or liquid-cooled structure, making it an appropriate choice for applications with complex cooling requirements. Its expansive fin construction allows for highly efficient heat dissipation, ensuring that the components it serves will remain cool and operating properly. The ATS-19C-55-C3-R0 also incorporates a number of innovative design features, including an external heat sink and fan assembly for added heat removal, as well as a modular mounting system for easy installation.The ATS-19C-55-C3-R0 thermal-heat sink operates using the principle of thermal-conductivity. Heat is generated at a source such as a processor, and is conducted away from this source through carefully designed structures and materials that are thermally conductive (such as aluminum and copper). These materials are constructed in such a way that they funnel heat through the thermal-heat sink itself, allowing for effective heat removal.The ATS-19C-55-C3-R0 thermal-heat sink is capable of providing effective cooling solutions in a variety of applications, including power supplies and high-end gaming computers. Its robust construction provides superior thermal-conductivity for effective heat removal, while its external heat sink and fan assembly, combined with its modular mounting system, make the product easy to install and maintain. The ATS-19C-55-C3-R0 is an ideal choice for anyone looking for an effective and reliable thermal-heat sink solution.
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