
Allicdata Part #: | ATS-19C-59-C1-R0-ND |
Manufacturer Part#: |
ATS-19C-59-C1-R0 |
Price: | $ 3.86 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X30MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.50469 |
30 +: | $ 3.31002 |
50 +: | $ 3.11535 |
100 +: | $ 2.92062 |
250 +: | $ 2.72591 |
500 +: | $ 2.53120 |
1000 +: | $ 2.48253 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.181" (30.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.91°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal-heat sinks are often used to provide cooling for a variety of different electronic components, and the ATS-19C-59-C1-R0 is an excellent example of this type of technology. This article will discuss the application field and working principles of the ATS-19C-59-C1-R0 and how it can be applied in different settings.
The ATS-19C-59-C1-R0 thermal-heat sink is a rectangular heatsink that is made from extruded aluminum fins. It is designed to help dissipate heat from small electronic components, such as power supply components, voltage regulators, and microprocessors. The ATS-19C-59-C1-R0 features a large base area in order to maximize contact area to the source component, and the fins are designed to help increase the surface area to allow for maximum cooling potential. The heat sink is also fitted with snap clips on the side to facilitate mounting and securing to a circuit board, as well as metal plates at the top and bottom for additional thermal conductivity.
The ATS-19C-59-C1-R0 is designed to be ideal for applications that require high power output and/or a small form factor; such as, power supplies, voltage regulators, and microprocessors. Additionally, due to its small size and lightweight construction, the ATS-19C-59-C1-R0 is easy to install and maintain. The large base area and specially designed fins allow the heat sink to effectively dissipate heat in a variety of working environments, making it a great choice for a variety of applications.
The ATS-19C-59-C1-R0 relies on the principle of convection, which is the transfer of heat from one body to the other by the movement of air or liquid. Since hot air or liquid rises, it allows the ATS-19C-59-C1-R0 to remove excess heat from a component and dissipate it into the surrounding environment. The aluminum fins that make up the ATS-19C-59-C1-R0 increase the surface area and allow for a more efficient transfer of heat. This increased surface area also helps increase the cooling capacity of the ATS-19C-59-C1-R0, as it can dissipate more heat in a shorter amount of time when compared to traditional heatsinks.
Overall, the ATS-19C-59-C1-R0 is an ideal solution for applications that require high power output and/or a small form factor. The use of the extruded aluminum fins and snap clips allow for easy installation and the large base area and increased surface area help to ensure effective heat dissipation. Additionally, the ATS-19C-59-C1-R0 operates on the principle of convection, which helps to effectively and efficiently transfer and dissipate heat from the source component into the surrounding environment. The ATS-19C-59-C1-R0 is an ideal choice for use in a variety of different applications and settings.
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