Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.33°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-19C-60-C1-R0 Thermal - Heat Sinks Applications and Working Principle

Thermal - Heat Sinks are a type of cooling solution that is used to dissipate heat away from electronic components and other heat-generating objects. Thermal - Heat Sinks are composed of an aluminum or copper base with fins that provide increased surface area to dissipate heat generated from the heat source. The ATS-19C-60-C1-R0 Thermal - Heat Sink is a popular heatsink used for reducing the operating temperature of various industrial and consumer electronics.

Applications

The ATS-19C-60-C1-R0 Thermal - Heat Sink is a widely used heatsink in the industrial and consumer electronics industry. It is frequently used to reduce the operating temperature of electronic components such as processors, motors, relays, and power supplies. The ATS-19C-60-C1-R0 Thermal - Heat Sink is also often used for cooling applications in industrial and laboratory equipment. It is commonly used for equipment that requires high levels of thermal performance, such as testing and monitoring equipment.The ATS-19C-60-C1-R0 Thermal - Heat Sink is available in various sizes, shapes, and configurations to meet the specific needs of various applications. It is available with different fan sizes, fan speeds, and materials to maximize performance and minimize noise levels. It is also available with multiple mounting systems, such as clip mounting or screw mounting, which allow for easy installation and removal of the heatsink.

Working Principle

The ATS-19C-60-C1-R0 Thermal - Heat Sink works by dissipating heat away from the device. Heat is generated from the device and transferred to the heatsink via thermal conduction. The heatsink then dissipates the heat into the surrounding environment or to another heat exchanger.The ATS-19C-60-C1-R0 Thermal - Heat Sink is designed so that the heat generated by the device is efficiently transferred away from it. This is done by providing a large surface area that allows for efficient heat transfer. The heatsink features an aluminum or copper base with fins that increase the surface area for efficient heat dissipation. The fins also increase air flow, which improves the rate at which heat can dissipate.The ATS-19C-60-C1-R0 Thermal - Heat Sink is also designed with various mounting systems, such as clip mounting or screw mounting. This allows for easy installation and removal of the heatsink, providing greater flexibility for different applications. The heatsink also features various fan sizes and materials to ensure efficient operation and reduce noise levels.

Conclusion

The ATS-19C-60-C1-R0 Thermal - Heat Sink is a popular cooling solution used for reducing the operating temperatures of various industrial and consumer electronics. It is composed of an aluminum or copper base with fins that provide increased surface area to dissipate heat. It is available with various fan sizes, fan speeds, and materials to maximize performance and reduce noise levels. It also has multiple mounting systems for easy installation and removal. The ATS-19C-60-C1-R0 Thermal - Heat Sink is a reliable solution for keeping electronics running smoothly and efficiently.

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