| Allicdata Part #: | ATS-19C-60-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-60-C3-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-60-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.91734 |
| 30 +: | $ 3.69936 |
| 50 +: | $ 3.48188 |
| 100 +: | $ 3.26422 |
| 250 +: | $ 3.04660 |
| 500 +: | $ 2.82899 |
| 1000 +: | $ 2.77459 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19C-60-C3-R0 thermal heat sink is a specially designed component used for thermal management. The heat sink helps to dissipate the heat generated from electronic components, such as CPUs, ASICs, microprocessors, etc. It is commonly used for applications involving high performance and high power components, such as those found in servers, gaming consoles, workstations, computers, and other electronic equipment.
The basic design of the ATS-19C-60-C3-R0 consists of a heat sink base attached to a top portion. The heat sink base is designed to dissipate heat through conduction from the electronic components to the surrounding air. The top portion consists of an array of aluminum fins, which increases the surface area of the heat sink, allowing for more efficient heat transfer to the surrounding environment. The combination of the two creates a highly efficient heat transfer system that effectively dissipates heat from the electronic components it is designed to protect.
The heat transfer process works by first removing the heat from the surface of the electronic components and transferring it to the base of the heat sink. From there, the heat is conducted through the heat sink and disbursed into the atmosphere. The fins on top of the heat sink also enhance the rate of heat transfer by increasing the surface area of the heat sink and allowing more air flow over the fin surfaces. This creates more efficient air cooling of the components and increases the effectiveness of the heat sink in cooling applications.
In addition to its cooling capabilities, the ATS-19C-60-C3-R0 also has a number of other uses. This type of heat sink can be used as a voltage regulator, as well as a power supply stabilizer, both of which are important features for any modern electronic device. The heat sink can also be used as an integral part of a heat pipe design, which improves the thermal efficiency of a larger system by allowing the heat to be spread more evenly between multiple heat exchangers, such as cooling fans.
Overall, the ATS-19C-60-C3-R0 is an effective and efficient component for cooling of electronic components in demanding applications. It features a highly efficient heat transfer system and a variety of other uses, allowing it to be an effective and versatile solution for any type of cooling needs. Whether it is used in a power supply regulator, as part of a larger heat pipe design or simply as a cooling source for high-performance devices, the ATS-19C-60-C3-R0 can provide reliable and long-lasting service for any thermal management application.
The specific data is subject to PDF, and the above content is for reference