| Allicdata Part #: | ATS-19C-72-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-72-C3-R0 |
| Price: | $ 5.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-72-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.59270 |
| 30 +: | $ 4.33776 |
| 50 +: | $ 4.08253 |
| 100 +: | $ 3.82738 |
| 250 +: | $ 3.57220 |
| 500 +: | $ 3.31704 |
| 1000 +: | $ 3.25324 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19C-72-C3-R0 is a high-performance, cost-effective, and reliable thermal – heat sink. The built-in technologies make it ideal for a range of applications, such as mediator devices, LEDs, ASICs, power supplies, and motor controllers.
The heat sink is constructed from aluminum alloy with optimized fin designs. The anodized finish prevents oxidation and the durable material increases its longevity. The fins are arranged in an optimized pattern to enhance heat dissipation more efficiently. The ends are optimally joined to reduce air gaps and ensure maximum heat transfer. The device is designed to operate in any environment from -20°C to +75°C.
The ATS-19C-72-C3-R0 has a variety of surface mount options. The standard model has 4 pins arranged for a standard +3V through-board mounting. The pressure screw terminal provides a secure connection for any compatible devicers. The optional boards and heatsink pads provide additional compatibility and mounting options.
The ATS-19C-72-C3-R0 utilizes an advanced thermoelectric air-cooling system that dissipates heat more efficiently than traditional cooling systems. The design ensures a more even heat distribution throughout the heat sink, reducing hot spots and potential damage to the components. The system is also designed to reduce noise generation and power consumption.
The heat sink also utilizes a patented active self-cleaning system. Sensors embedded in the heat sink monitor for dust particles and dirt, and activates a fan to clean the surface with a gentle blast of air. This reduces the chances of dust buildup, ensuring optimal cooling at all times.
The ATS-19C-72-C3-R0 is ideal for applications where high performance and reliability are essential. It is ideal for use in mediator devices, LED circuits, power supplies, motor controllers, and ASICs, among other applications. The advanced cooling technology and dust-free environment ensure constant performance and extended life.
The specific data is subject to PDF, and the above content is for reference