| Allicdata Part #: | ATS31727-ND |
| Manufacturer Part#: |
ATS-19C-80-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-80-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks play an important role in modern electronics, and the ATS-19C-80-C2-R0 is a specialized heat sink designed to provide reliable heat dissipation for a wide range of applications. This heat sink is engineered with the latest technology to handle high levels of heat flux and provide a smooth transfer to the environment, allowing it to provide maximum efficiency in cooling electronics. In order to effectively utilize the ATS-19C-80-C2-R0, it is important to understand its application field and working principle.
Application Field
The ATS-19C-80-C2-R0 is designed to provide reliable heat dissipation for high-powered electronics, allowing them to function at optimal levels and provide maximum efficiency. This heat sink is capable of dissipating a large amount of heat and is suitable for applications such as power supplies, home electronics, automotive components, and more. It is specifically designed to be used in conjunction with the latest microelectronic components and features a high-performance, compact design that allows for easy installation and efficient cooling of electronics.
Working Principle
The working principle of the ATS-19C-80-C2-R0 heat sink is based on thermal-transfers. It relies on the convection process, where the heat is conducted away from the components and radiated into the surrounding air. The thermal contact between the heat sink and the component is maximized via the use of compression fittings, which help to evenly dissipate the heat and maximize thermally-conductive performance. The heat sink also features an extruded aluminum fin structure that helps to dissipate the heat quickly and efficiently from the component to the environment. This helps to keep the overall temperature of the component and the system within a desirable range.
The ATS-19C-80-C2-R0 is designed to provide maximum performance and reliability in cooling high-powered electronics. It features a compact design with a total height of 19mm and a weight of only 80g. It is designed to dissipate heat away from the component at a maximum rate and ensure that the temperature of the system stays within the desired range. This heat sink is also designed to accommodate a range of different component sizes and can be applied in various scenarios.
Conclusion
The ATS-19C-80-C2-R0 is a specialized heat sink designed to provide reliable heat dissipation for a wide range of applications. Its application field is designed for high-powered and advanced electronics, such as power supplies, home electronics, automotive components, and more. Its working principle is based on thermal-transfer and relies on convection to quickly and efficiently dissipate heat away from the component. Its design is also optimized for ease of installation and maximum thermally-conductive performance, allowing it to provide reliable cooling for a range of different components.
The specific data is subject to PDF, and the above content is for reference