ATS-19C-92-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	16.58°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks

Thermal-Heat Sinks are components which absorb heat from an electronic component like a CPU, and then dissipate it into the surrounding environment using a combination of natural convection and conduction. A Thermally-Heat Sink is a great way to reduce temperatures, and increase the lifespan of the device in the process.

What is ATS-19C-92-C3-R0?

The ATS-19C-92-C3-R0 is a popular high performance thermal-heat sink designed for a wide range of applications. It features an advanced internal design which maximizes the cooling efficiency by allowing for maximum heat dissipation without compromising structural integrity. This thermal-heat sink uses high-efficiency aluminum fins, which provide excellent passive airflow and ensure that heat is quickly and effectively dissipated. It also includes a cleverly designed contact interface, which minimizes thermal resistance, and optimizes total heat transfer.

ATS-19C-92-C3-R0 Application Field and Working Principle

The ATS-19C-92-C3-R0 thermal-heat sink is ideally suited for use in a wide range of applications, including computers, gaming consoles, and industrial automation systems. It is also suitable for use in cooling graphics cards or in specialized high thermal demand applications like CPUs and GPUs. The ATS-19C-92-C3-R0 is also capable of cooling multiple components simultaneously, making it an ideal choice for multi-purpose applications.The working principle of the ATS-19C-92-C3-R0 involves the process of convection. The air in its environment is warmed and rises. As the air rises, it passes over the fins which have sunken into the heat sink. These fins absorb the heat as the air passes over them, allowing the heat sink to remain at a cooler temperature. This process of heat dissipation is then repeated, resulting in a continuous cooling cycle.The ATS-19C-92-C3-R0’s thermal-heat sink design also includes a contact interface which ensures maximum heat transfer. This is accomplished through direct contact between the heat sink and the device being cooled. By providing a direct contact between the two components, thermal resistance is minimized and maximum thermal exchange is achieved.

Conclusion

The ATS-19C-92-C3-R0 thermal-heat sink is an ideal solution for a wide range of applications, from computer and gaming systems to industrial automation systems. Its advanced design ensures maximum heat dissipation and maximum thermal efficiency, making it an effective and reliable cooling solution. Its direct contact design optimizes heat transfer, ensuring that temperatures remain low and devices remain safe from damage caused by overheating.

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