| Allicdata Part #: | ATS-19C-97-C3-R0-ND |
| Manufacturer Part#: |
ATS-19C-97-C3-R0 |
| Price: | $ 3.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19C-97-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.60801 |
| 30 +: | $ 3.40746 |
| 50 +: | $ 3.20695 |
| 100 +: | $ 3.00655 |
| 250 +: | $ 2.80610 |
| 500 +: | $ 2.60565 |
| 1000 +: | $ 2.55554 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.39°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a critical component in products requiring heat dissipation. However, if the heat sink device is not suitable for the particular application, it can be ineffective or even cause a system failure. The ATS-19C-97-C3-R0 thermal heat sink is an example of a popular piece of equipment used in a variety of applications. This article will discuss the application field and working principle of the ATS-19C-97-C3-R0.
The ATS-19C-97-C3-R0 thermal heat sink is a compact and lightweight device, designed to effectively dissipate heat generated in electronic devices. It is constructed from a combination of aluminum and copper materials, which provide superior heat transfer performance. The ATS-19C-97-C3-R0 thermal heat sink features a highly efficient fin design which maximizes the air flow between the fins for improved thermal performance. Its combination of high performance and low weight make it an ideal choice for many applications, including servers, telecommunications equipment, and industrial control applications.
The working principle of the ATS-19C-97-C3-R0 thermal heat sink is relatively straightforward. Heat is conducted away from the hot components of the electronic device and then transferred to the heat sink. This process begins as soon as the device is powered on, and the temperature of the components rises. The heat is drawn away from the components by the copper material which has good thermal conductivity. The heat is then spread over the surface of the heat sink fins, which aid in dissipating the heat by providing an increased surface area for heat dissipation.
The heat is then dissipated into the surrounding environment, using natural convection or forced air cooling. Forced air cooling is often used if the heat sink is positioned near an exhaust vent. Natural convection cooling is used when the heat sink is positioned in an area with limited air flow. Both cooling methods offer effective cooling of the hot components, allowing the device to remain operational with minimal risk of overheating.
In addition to dissipating heat, the ATS-19C-97-C3-R0 thermal heat sink also reduces the risk of component damage caused by thermal shock. The fast heat transfer performance of the copper material ensures that the temperature of heated components is not allowed to rise too quickly, thus reducing the chance of damage to sensitive electronic components. Furthermore, the highly efficient fin layout also ensures that air flow is sufficient to cool the electronic device sufficiently and keep component temperatures stable.
The ATS-19C-97-C3-R0 thermal heat sink is a popular choice for many applications due to its combination of high performance, light weight, and cost-effectiveness. It is ideal for use with a wide range of electronic devices, including servers, telecommunications equipment, and industrial control systems. Its combination of fast heat transfer performance and efficient fin layout ensures that it can be used effectively in most applications, providing effective and reliable cooling while reducing the risk of component damage due to thermal shock.
The specific data is subject to PDF, and the above content is for reference