ATS-19D-10-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.87°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-19D-10-C1-R0 Heat Sinks: Application Field and Working Principle

Heat sinks are one of the most commonly used pieces of equipment in the field of thermal management. They are commonly used in the form of small metal or plastic plates, strips, or fins to dissipate heat from electronic components and other equipment. The ATS-19D-10-C1-R0 heat sink is a type of heat sink designed specifically for use in applications where the design demands extreme thermal performance. This article will explore the application field and working principle of the ATS-19D-10-C1-R0 heat sink.The ATS-19D-10-C1-R0 heat sink was designed with high heat dissipation and retention in mind. This makes it ideal for applications where heat generated by its components needs to be effectively and quickly dissipated. The sink is designed to absorb heat from any component that is placed on it quickly and effectively, and then dissipate it away quickly. This makes it an ideal choice for applications where there is a need to maintain efficient heat dissipation, such as in CPU and GPU cooling systems.The primary material used in the construction of the ATS-19D-10-C1-R0 sink is aluminum, which is a very good thermal conductor. Aluminum, when used in combination with the fins of the sink, has excellent thermal performance, which is why it is such an effective heat sink for components with high heat output.The working principle of the ATS-19D-10-C1-R0 heat sink involves a number of components working in unison to provide an effective thermal transfer solution. Firstly, the aluminum fins are designed with a shallow depth, which enables them to effectively absorb heat from the component mounted on the sink. Secondly, the heat from the component is then transferred to the air surrounding the heat sink via convection. The heat is also dissipated by the fins of the sink, which increases the surface area of the fins and allows for increased heat dissipation. Lastly, the air around the heat sink is cooled by a fan mounted on the back of the sink, which further accelerates the air cooling process.The ATS-19D-10-C1-R0 heat sink is an excellent thermal transfer solution for a wide range of applications. It is particularly useful for components that require exceptionally high heatsinks, such as CPUs and GPUs. The superior thermal performance of the sink makes it perfect for applications that require quick and effective heat dissipation to ensure the stability and longevity of the equipment. Furthermore, its high-quality construction and design ensures a long life expectancy and reliable performance.

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