ATS-19D-10-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS31756-ND

Manufacturer Part#:

ATS-19D-10-C2-R0

Price: $ 4.19
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19D-10-C2-R0 datasheetATS-19D-10-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.80520
10 +: $ 3.70125
25 +: $ 3.49574
50 +: $ 3.29011
100 +: $ 3.08448
250 +: $ 2.87885
500 +: $ 2.67322
1000 +: $ 2.62181
Stock 1000Can Ship Immediately
$ 4.19
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.89°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-19D-10-C2-R0 is a device from a family of thermal-heat sinks designed to effectively dissipate excess heat from high powered electronic components. Thermal heat sinks are commonly used in industrial, automotive, and consumer electronics products to prevent their components from overheating due to high levels of current. Heat is generated during the normal operation of high powered electronic components and can cause the components to fail if not properly dissipated. Thermal-heat sinks are utilized to transfer this heat away, ensuring the longevity of the components.The ATS-19D-10-C2-R0 is made from a high-grade aluminum material. Its structure consists of a main body with multiple heat fins. These fins increase the surface area of the device, allowing it to dissipate more heat from the device. It also includes an integrated fan to further assist in cooling the device. The fan rotates at an adjustable speed, helping to circulate the air around the heat sink.The ATS-19D-10-C2-R0 is a fairly efficient device, with a heat dissipation rate of up to 19W and a noise level of less than 20 dB(A). It is a reliable and cost-effective thermal heat sink solution for a variety of high power applications. The device also provides excellent protection from thermal cycling and is able to withstand up to 3000 thermal cycles without any damage to the device.The ATS-19D-10-C2-R0 is designed for use in a wide range of industrial, automotive, and consumer products, including the following: telecommunications equipment, power amplifiers, high-frequency devices, and LED lighting systems. This device is also used to cool and protect high power semiconductors in electronic systems. Due to its compact size and low noise level, it can fit into most electronic designs without issue.The mechanism behind the working of the ATS-19D-10-C2-R0 is extreme simple. Heat generated by the components on the printed circuit board is conducted to the top of the device by thermal conduction. The heat is then dissipated to the surrounding air by two methods; conduction and natural convection. The heat fins act like a radiator to easily dissipate heat to the air while the internal fan further assists to move more air around the heat sink.In conclusion, the ATS-19D-10-C2-R0 is a highly effective thermal-heat sink designed to provide reliable heat dissipation from high-powered electronic components and systems. This device is suitable for a wide variety of industrial, automotive, and consumer applications and comes with an adjustable fan speed to ensure efficient cooling of said components. With all of its features, this is an excellent choice for anyone looking for a cost-effective, reliable thermal heat sink.

The specific data is subject to PDF, and the above content is for reference

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