| Allicdata Part #: | ATS-19D-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-19D-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19D-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential part of any electronic system. The ATS-19D-10-C3-R0 is an example of a thermal management device used to dissipate heat from electronic components. This device, sometimes referred to as a heatsink, uses an array of fins to transfer the heat to a surrounding environment. This is an effective way of cooling components in tight spaces, and has become increasingly popular in mobile devices.
The ATS-19D-10-C3-R0 heat sink consists of a series of aluminum fins attached to a flat plate. The plate is then attached to the heat-generating component, typically by screws or adhesive. The fins act as radiators, increasing the surface area that is exposed to the ambient air around the device. As the air passes through the fins, it absorbs the heat, cooling the component.
The ATS-19D-10-C3-R0 is a popular choice for low-cost applications where it is necessary to dissipate a relatively low amount of heat from the component. It is an ideal solution for a wide range of consumer products, including computers, consumer electronics, and IoT devices. The thermal performance of the unit is optimized for low heat loads, making it a versatile choice for many applications.
The device is also capable of controlling the temperature of the component by adjusting the air flow rate through the fins. By doing so, the device is able to maintain the temperature of the component within a certain range, ensuring that the device will perform optimally. This feature is particularly useful when operating a device in an environment with fluctuating temperatures.
The ATS-19D-10-C3-R0 is also designed for easy installation and maintenance. The fins are easily removed and replaced if necessary, and the entire unit can be removed without the need for tools. This makes the device a great choice for applications where it may be necessary to make frequent adjustments to the thermal performance of the component.
The ATS-19D-10-C3-R0 is an effective and affordable solution for thermal management in a wide range of applications. Its low heat load capabilities and easy maintenance make it an ideal choice for any application where it is necessary to effectively and reliably dissipate heat. For these reasons, it is one of the most popular and trusted thermal solutions for many electronic and IoT devices.
The specific data is subject to PDF, and the above content is for reference