| Allicdata Part #: | ATS-19D-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-19D-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19D-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are designed to remove thermal energy from a system and disperse it into the environment. The ATS-19D-139-C1-R0 is a special type of thermal heat sink that offers increased cooling performance with its optimized heat transfer fins. This heat sink works by transferring heat away from the surface of the object it is attached to and dispersing it into the environment.
The ATS-19D-139-C1-R0 is a common choice in electronic components, computer components, and LED systems. It is primarily used in communications systems, but it can also be used to cool machine parts or other components that produce heat. This heat sink is suitable for operation in hazardous environments, ensuring safety and reliability in mission-critical applications.
The ATS-19D-139-C1-R0\'s design makes it capable of efficiently removing heat from its surface. To efficiently cool its environment, the heat sink features optimized, curved heat transfer fins. These fins increase air flow and heat dissipation, allowing it to dissipate more heat without increasing its profile. It also has a larger surface area compared to other thermal heat sinks, allowing it to dissipate more heat in a smaller area.
Along with its optimized design, the ATS-19D-139-C1-R0 also uses a thermally conductive bonding compound, which greatly enhances the heat transfer from its surface to the outside environment. This ensures that the heat is evenly distributed throughout the sink and allows for efficient heat dissipation. The entire assembly is mechanically attached to the object it is intended to cool, ensuring a secure and reliable connection.
The ATS-19D-139-C1-R0 also has a wide temperature range, making it suitable for environments that may reach temperatures far beyond normal operating temperatures. The wide temperature range ensures that it can still perform effectively at temperatures that would be too high for other heat sinks to handle. This added flexibility makes the ATS-19D-139-C1-R0 suitable for use in a variety of applications, from industrial to commercial.
In summary, the ATS-19D-139-C1-R0 is a special type of thermal heat sink that offers increased cool performance with its optimized heat transfer fins and thermally conductive bonding compound. Designed for use in communications systems, LED systems, and other applications, the ATS-19D-139-C1-R0 is capable of efficiently dissipating heat from its surface in a variety of environments with its wide temperature range. This makes the ATS-19D-139-C1-R0 an ideal choice for heat management applications.
The specific data is subject to PDF, and the above content is for reference