| Allicdata Part #: | ATS-19D-153-C1-R0-ND |
| Manufacturer Part#: |
ATS-19D-153-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19D-153-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management in electronic devices is a critical aspect that needs to be addressed in order for them to operate with maximum efficiency. The ATS-19D-153-C1-R0 heat sink is an ideal solution for general cooling applications, and is designed to provide optimal thermal conduction and heat dissipation. This thermal-heat sink is capable of dissipating heat generated by LED-based lighting systems, consumer electronics, medical equipment, power supplies, and other device applications.
The ATS-19D-153-C1-R0 heat sink features a compact design that does not require large fan or blower assemblies. It comprises an aluminum alloy heatsink body featuring an extruded profile, which helps to increase the surface area. This design helps to dissipate heat more efficiently, as compared to standard heat sinks. The ATS-19D-153-C1-R0 also features low thermal impedance, which allows for an even heat dissipation throughout the body of the device. Furthermore, the high thermal conductivity of the aluminum alloy minimizes thermal resistance, allowing for improved heat transfer from the device to the environment.
The heat sink also features mounting holes, which allow for easy installation in almost any system. This helps to reduce installation time, as well as allow for a secure connection to the device. Furthermore, the holes allow for various mounting configurations, helping to provide flexibility for the user. Additionally, the mounting holes feature closely-spaced concentric counterbores, which allow for a low-profile design, helping to conserve space.
The ATS-19D-153-C1-R0 heat sink also features a unique design that helps to promote airflow. The heat sink is designed with an air gap between its extruded fins and the system’s board, helping to draw in more air as the hot air expands. This helps to evenly disperse the heat, ensuring maximum cooling efficiency. Additionally, the fin shape also helps to increase the surface area, providing better heat dissipation.
Finally, the ATS-19D-153-C1-R0 heat sink also features a unique pin fin structure, which helps to create micro vortexes that help to further increase heat dissipation. This helps to optimize the overall thermal performance of the heat sink, while also providing high-performance airflow. Overall, the ATS-19D-153-C1-R0 heat sink is an ideal solution for low-cost thermal management, and is designed for efficient and reliable cooling in a variety of applications.
The specific data is subject to PDF, and the above content is for reference