| Allicdata Part #: | ATS-19D-159-C1-R0-ND |
| Manufacturer Part#: |
ATS-19D-159-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19D-159-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are often designed to prevent thermal damage to electrical circuits and components. The ATS-19D-159-C1-R0 is a typical example of this type of system. This thermal heat sink is specifically designed for use with high temperature electronic components.
ATS-19D-159-C1-R0 Application Field
The ATS-19D-159-C1-R0 is typically used in application fields that require high temperature protection. This includes automotive, aerospace, medical, industrial and domestic applications. In automotive applications, its usage extends to internal combustion engines, electric motors and motor controls. These thermal devices help reduce the risk of damage within the circuit due to thermal overloading.
ATS-19D-159-C1-R0 Working Principle
The ATS-19D-159-C1-R0 works by utilizing an array of fins and passages to transfer heat away from high temperature components. Thermal management technologies like this are critical to many commercial and military electronics. The fins increases the surface area of direct contact between the component and the thermal devices, thus increasing heat dissipation effectiveness. Since heat is dissipated quickly, these thermal heat sinks help prevent thermal overloading and other problems.
The ATS-19D-159-C1-R0 is designed with an extended aluminum frame that contains set number of fins. To prevent overheating, the fins can be adjusted based on the application and the power requirement. This is due to the fins having a direct relationship to the thermal performance of the system. Finally, the ATS-19D-159-C1-R0 also contains a built-in fan that helps to dissipate the heat even faster.
Conclusion
The ATS-19D-159-C1-R0 is a thermal heat sink that is designed for high temperature protection of electronic components. The device uses an array of fins and passages to quickly dissipate heat away from the component. Additionally, an adjustable fin configuration allows for better thermal performance. Finally, this thermal design also includes a built-in fan that helps for even faster heat dissipation. The ATS-19D-159-C1-R0 is a must have for any application that necessitates high temperature protection.
The specific data is subject to PDF, and the above content is for reference