| Allicdata Part #: | ATS-19D-167-C1-R0-ND |
| Manufacturer Part#: |
ATS-19D-167-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19D-167-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-19D-167-C1-R0 application field and working principle
The ATS-19D-167-C1-R0 is one of the most advanced and widely used thermal management solutions in the industrial sector. It is a multi-functional, cost-effective heat sink specifically designed to dissipate heat from high-end electronic components, such as CPUs, GPUs, FPGAs, and other computer systems and high-end electronics.
The ATS-19D-167-C1-R0 is made of durable aluminum and is designed with high efficiency fins, in order to ensure maximum thermal performance. The thermal sink is designed for maximum convenience, as its dimensions make it possible to be mounted in many different configurations, with the use of optional accessories. Heat is dissipated away from the system, allowing it to operate at peak performance and efficiency.
The ATS-19D-167-C1-R0 is ideal for applications where fast and effective heat dissipation is needed, such as computing systems, embedded motherboards, industrial controllers, and other electronic components. It is also used in other areas, such as energy storage systems, automotive applications, drones, and various other fields.
In order to ensure optimal operation, the heat sink should be installed on an air-cooled surface which will enable the efficient transfer of heat away from the electronics to the surrounding environment. This type of cooling system allows for a longer lifespan as the electronics are kept cool and at a constant temperature. In addition, the ATS-19D-167-C1-R0 benefits from its low-profile design, making it suitable for applications with limited space.
The ATS-19D-167-C1-R0 also features intelligent thermal technology, which is able to monitor and adjust the temperature through its electronic control, which can be used with various temperature parameters. This allows the most efficient and effective cooling to be achieved, as the thermal management system can be adjusted to meet the specific requirements of the application.
In conclusion, the ATS-19D-167-C1-R0 heat sink is a multi-functional, cost-effective approach to thermal management. It is designed with high efficiency fins, making it suitable for a variety of applications. Its low profile design and intelligent thermal technology make it the ideal heat sink for electronics requiring effective and efficient cooling.
The specific data is subject to PDF, and the above content is for reference