| Allicdata Part #: | ATS-19D-182-C1-R0-ND |
| Manufacturer Part#: |
ATS-19D-182-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19D-182-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a complex task which calls for proper solutions and components that are reliable, cost-efficient, reliable and adjustable. The ATS-19D-182-C1-R0 thermal management component is one of the most advanced and reliable thermal management solutions developed by Alpha Thermal Solution. This component addresses the challenge of developing a reliable and cost-effective thermal solution for applications ranging from microelectronics to medical, industrial, aerospace, automotive and more.
The ATS-19D-182-C1-R0 thermal management component is a highly efficient and flexible thermal solution with a broad range of applications. This open-frame thermal solution is designed to provide efficient thermal management for a wide variety of applications with high ambient temperatures. The component offers an excellent choice for applications with high-performance, high-heat-load and high-power-load levels, where strong thermal performance is essential.
The ATS-19D-182-C1-R0 is made from a range of high-efficiency heat sinks with optimized air flow for increased airflow and higher thermal performance. This component is designed with adjustable mounting brackets and a unique locking feature that allow the heat sink to be securely mounted to the application. The ATS-19D-182-C1-R0 is designed for maximum flexibility and can be used in applications with different construction materials, such as aluminum, copper, brass and other materials. It is also compatible with a variety of fan assemblies and mounting systems.
The ATS-19D-182-C1-R0 has been designed to meet or exceed the standards and requirements of a wide range of applications. This thermal management component has an optimal heat transfer rate, which ensures the highest efficiency and performance. The component is also designed for maximum reliability and durability, featuring an extended product life. This component also has excellent thermal performance with an extended operational temperature range.
The working principle of the ATS-19D-182-C1-R0 component is based on the concept of heat pipes which are designed to transfer the heat generated by the application to the thermal solution. Heat pipes use a liquid medium to conduct heat away from hot surfaces such as processors and components and transfer it to cooler areas. The ATS-19D-182-C1-R0 component is designed to maximize the efficiency of heat pipes, allowing for a more efficient heat transfer and improved thermal performance.
The ATS-19D-182-C1-R0 is an ideal solution for a variety of thermal management applications. This component is designed to be easily integrated into the thermal management solution for a wide range of applications. The component is also designed for maximum efficiency and optimized airflow for increased thermal performance. This component is an ideal choice for applications with high thermal demands and high-performance requirements.
The specific data is subject to PDF, and the above content is for reference