ATS-19D-185-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-19D-185-C3-R0-ND

Manufacturer Part#:

ATS-19D-185-C3-R0

Price: $ 4.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X30MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19D-185-C3-R0 datasheetATS-19D-185-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.88647
30 +: $ 3.67059
50 +: $ 3.45467
100 +: $ 3.23870
250 +: $ 3.02279
500 +: $ 2.80687
1000 +: $ 2.75290
Stock 1000Can Ship Immediately
$ 4.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks
ATS-19D-185-C3-R0 is a new generation of thermal heat sink technology, designed to increase the CPU performance and reduce power dissipation. Developed by Advanced Thermal Solutions, Inc., this product is the result of many years of research and development, and it is being used in many different applications.The key to improving a system’s performance is effective heat dissipation. The ATS-19D-185-C3-R0 heat sink is designed with the latest cooling technologies, with fins that are curved to induce turbulent air flow. This combination helps the device to efficiently transfer heat from the CPU to the fins. The fins are spaced closer together as a part of the design, which reduces the airflow resistance, resulting in better heat dispersal.The heat sink also features a unique airflow baffle that turns the air in anisotropic flow and helps to create a boundary layer, which helps to reduce any heat buildup. The item’s ribbed design promotes better heat dissipation and provides a wide range of mounting options. The ATS-19D-185-C3-R0 heat sink is designed to be used in numerous applications. It is suitable for both normal and silent operating modes, and it can be combined with existing fans to further improve CPU cooling performance. Additionally, the item has been designed to be compatible with most popular motherboards and motherboards for the latest CPUs.One of the unique features of this item is its ability to dynamically adjust the speed of the fans to match the running CPU temperature. This means it can work harder to dissipate heat when the temperature rises, and reduce its fan speed when the temperature is lower. The device also supports liquid cooling and is available in options with a single dual-channel fan or two separate fans, giving users the flexibility to customize according to their needs.In addition, the device has an advanced thermal sensor that helps to keep track of temperature changes in the system. This helps users to monitor the temperature in real time, which enables them to make corrections if the device is running too hot. The product also has an advanced thermal management system that is designed to fine-tune the speed of the fan based on the temperature of the CPU. This further enhances the cooling performance of the item, ensuring that the CPU works efficiently without overheating.Overall, the ATS-19D-185-C3-R0 heat sink is a great product for anyone who needs an efficient and reliable cooling solution. With its innovative design and advanced features, the item is ideal for a range of applications in electronics, including gaming platforms, PCs and servers. The item\'s advanced features ensure that the CPU runs efficiently, preventing any overheating that could damage the system.

The specific data is subject to PDF, and the above content is for reference

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