ATS-19D-187-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.68°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-19D-187-C1-R0 is a type of thermal heat sink, which is an important part of many electronics and engineering projects. It is designed to dissipate the heat from electric circuits and other electronic components by providing extra surface area to promote thermal conductivity. Heat sinks are designed to provide a reliable and efficient system for cooling electronic components, as well as prolonging their life. They are typically made of aluminum or copper, but can also be constructed using other materials such as plastics and metals.

Application Field

The ATS-19D-187-C1-R0 is primarily used in applications where there is a need for reliable heat dissipation. It is ideal for use in applications such as computers and other electronic devices, industrial control systems, handheld devices, and in automotive applications. It can also be used in a wide range of other industries, such as telecommunications, aerospace, and military applications. This thermal heat sink is designed for use with a wide range of components, including integrated circuits and power transistors. It is usually used as a primary or supplemental cooling solution, and is capable of operating at temperatures up to 150 degrees Celsius. The ATS-19D-187-C1-R0 is an efficient heat transfer device, since its design maximizes its surface area and uses advanced heat dissipation techniques. It is designed to deliver superior thermal performance and to facilitate easy installation in limited space applications.

Working Principle

The ATS-19D-187-C1-R0 works in several different ways to dissipate heat from electronic components. It is designed to conduct heat away from the heat source, and then transfer it to a sink at a lower temperature. Heat sinks come in many different types, including active and passive designs.The ATS-19D-187-C1-R0 uses a passive design, which means it uses its physical shape to trap and channel heat and then move it away from the component. The physical shape of this type of heat sink is usually designed to maximize its surface area, which helps it to cool more efficiently. The heat is then absorbed by the thermal conducting materials, which are usually aluminum or copper. The heat is then dissipated either through convection or radiation. In convection, the heat is moved off the component to a sink at a lower temperature, such as the surrounding air or a larger metal object. Radiation is another way to move heat off the component, using electromagnetic waves. The ATS-19D-187-C1-R0 is also designed to be easy to install. It is usually supplied with mounting screws, enabling easier installation in limited space applications.

Conclusion

The ATS-19D-187-C1-R0 is a thermal heat sink, which is designed to provide reliable and efficient heat dissipation from electronic components. It is used in a wide range of applications, such as computers and other electronic devices, industrial control systems, handheld devices, and in the automotive industry. It can also be used in other industries, such as telecommunications, aerospace, and military applications. It is designed to maximize its surface area and use advanced heat dissipation techniques, and is capable of operating at temperatures up to 150 degrees Celsius. It works using a passive design, which involves trapping and channeling heat and then dissipating it through either convection or radiation. The ATS-19D-187-C1-R0 is easy to install, using mounting screws making it ideal for limited space applications.

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