| Allicdata Part #: | ATS31884-ND |
| Manufacturer Part#: |
ATS-19D-27-C2-R0 |
| Price: | $ 7.71 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19D-27-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.94260 |
| 10 +: | $ 6.75486 |
| 25 +: | $ 6.37963 |
| 50 +: | $ 6.00440 |
| 100 +: | $ 5.62918 |
| 250 +: | $ 5.25390 |
| 500 +: | $ 4.87862 |
| 1000 +: | $ 4.78480 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are devices made from metal that absorb and disperse heat away from components and delicate electronic equipment. The ATS-19D-27-C2-R0 is an example of a heat sink, designed for electronics, requiring low airflow and a compact size. It is compatible with all standard chip sets and manufactured components.
The ATS-19D-27-C2-R0 heat sink features a stylish black anodized finish with a dimpled sur- face, which increases the surface area to better dissipate the heat. It has an optimized profile that ensures consistent temperatures and can be mounted with either hardware or an adhesive. The profile also increases resistance to mechanical shock and increases the heat sink’s rigidity.
The ATS-19D-27-C2-R0 heat sink is designed to work in a wide range of applications. Its optimized profile makes it suitable for mobile electronics, medical devices, automotive electronics, computers, consumer electronics, etc. Its lightweight design makes it great for portable electronics due to its low power consumption and low profile design.
At the heart of the ATS-19D-27-C2-R0 is a dual-layer construction, which combines a unique combination of materials and processes to maximize heat transfer and reduce dissipation of heat to other parts of the system. The heat sink utilizes aluminum plates to transfer heat away from the component, into the Microlon® Thermal Transfer Layer which is located between the plates. The alu- minum plates are then connected to each other through a series of pins, allowing them to move and function as one large unit.
In addition to its dual-layer construction, the ATS-19D-27-C2-R0 is equipped with a specifically designed airflow system. A high-efficiency fan pulls air into the cavity located between the plates, and the air is then forced across the cavity by a series of fins. This allows for the most efficient heat transfer and dissipation possible.
The ATS-19D-27-C2-R0 is designed to be used in both embedded and open air systems, making it a versatile heat sink option. Its relatively low profile and ability to dissipate heat quickly help it to be effective in confined spaces. Its high-efficiency fan helps it to be effective in both situations.
Overall, the ATS-19D-27-C2-R0 is a highly efficient heat sink, designed for use in a variety of applications. Its dual-layer construction and airflow system make it effective in dissipating heat away from delicate components and electronics, helping to increase the life of the equipment and reduce the risk of overheating. This heat sink is a great choice for both embedded and open air systems.
The specific data is subject to PDF, and the above content is for reference