| Allicdata Part #: | ATS-19D-92-C3-R0-ND |
| Manufacturer Part#: |
ATS-19D-92-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19D-92-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an increasingly important element of many products as electronics continue to get smaller and more efficient. The ATS-19D-92-C3-R0 is an advanced thermal management solution specifically designed for chipsets and other high-performance applications. This particular thermal solution uses a combination of thermal dissipation principles and an innovative design to promote efficient cooling and minimize noise and interference.
The ATS-19D-92-C3-R0 is a thermally managed heat sink. It is built with an aluminium base plate and a high-density graphite fin structure. The fin structure has excellent heat-dissipating properties which help to efficiently spread and dissipate the heat generated by other components. The dissipated heat is then passed to the environment via conduction, convection, and/or radiation. The fins are lightweight yet highly efficient for cooling, and they also reduce the system cost.
The ATS-19D-92-C3-R0 features an innovative design that maximizes heat transfer while taking up very little space. By utilizing a combination of direct contact heat pipes, air gap conductors, and space-saving heat spreaders, the heat sink offers maximum heat transfer in a very small package. This design also ensures a very low noise level, which is ideal for environments where noise is a concern.
The ATS-19D-92-C3-R0 also features a temperature controller to help maintain optimal temperature levels. This temperature controller is capable of adjusting the fan speed to adapt to changes in system load or environment. By adjusting the fan speed, the temperature controller ensures that the device runs at peak efficiency without overheating. This temperature controller also features an integrated temperature sensor to ensure that the device is not too hot or too cold and can be remotely monitored.
The ATS-19D-92-C3-R0 is well suited for use in many applications, including consumer electronics, telecoms, and automotive. Its high-performance thermal solution makes it ideal for high-performance applications with minimal noise levels. The device is also an ideal solution for high-density computing, where it can efficiently cool multiple components without taking up a large amount of space.
In conclusion, the ATS-19D-92-C3-R0 is an advanced thermal management solution that is well suited for high-performance applications. It utilizes a combination of direct contact heat pipes, air gap conductors, and space-saving heat spreaders to maximize heat transfer. It is also equipped with a temperature controller to adjust fan speed and maintain optimal temperature levels. Finally, the device is lightweight yet highly efficient for cooling, and is well-suited for many different applications.
The specific data is subject to PDF, and the above content is for reference