ATS-19E-02-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19E-02-C1-R0-ND

Manufacturer Part#:

ATS-19E-02-C1-R0

Price: $ 3.20
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19E-02-C1-R0 datasheetATS-19E-02-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.91249
30 +: $ 2.83395
50 +: $ 2.67649
100 +: $ 2.51899
250 +: $ 2.36157
500 +: $ 2.28284
1000 +: $ 2.04668
Stock 1000Can Ship Immediately
$ 3.2
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.29°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are an important part of thermal management in electronics applications. A well-designed heat sink can efficiently evacuate the heat generated by the components and keep the system temperature low, improving system reliability and lifetime. The ATS-19E-02-C1-R0 heat sink is a compact and lightweight aluminum heat sink designed for use in compact electronic systems and high-heat applications, such as power electronics and automotive applications.

The ATS-19E-02-C1-R0 is designed with a pinned copper base that provides superior thermal conductivity and a fin array that maximizes heat dissipation. Its design evaluates natural convection, fin surface area and thermal resistance (Rth) to ensure optimum thermal management for high powered electronic components. Moreover, it is protected by an advanced protective coating that is resistant to corrosion and offers superior thermal conductivity.

When it comes to installation, the ATS-19E-02-C1-R0 utilizes a simple bolt and nut system, which makes it easy to install in most electronic systems. The heat sink can also be customized with different thermal management components including thermocouples, fans, and heat pipes.

As for its working principle, the ATS-19E-02-C1-R0 heat sink is designed to replace the heat generated by electronic components with the cooler external environment. This is accomplished by making the thermal resistance of the part equal to the thermal resistance of the ambient environment. As heat is transferred through the part, the heat is moved away from the component and is dispersed by the fin array. This ensures that an optimal temperature can be maintained within the system. In addition, the heat sink’s thermal properties can also be adjusted by using different components such as thermocouples, fans, and heat pipes if necessary.

Overall, the ATS-19E-02-C1-R0 heat sink is a perfect choice for electronic systems that require efficient thermal management. It is compact, lightweight, and designed with advanced features to ensure maximum heat dissipation with minimal thermal resistance. Furthermore, it is easy to install and can be customized to the user’s specific needs.

The specific data is subject to PDF, and the above content is for reference

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