| Allicdata Part #: | ATS-19E-05-C1-R0-ND |
| Manufacturer Part#: |
ATS-19E-05-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19E-05-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal solutions have always been a key component of any device that requires a significant amount of heat to be dissipated efficiently and quickly. The ATS-19E-05-C1-R0 is an aluminum heat sink designed to offer an excellent thermal solution for electronics that generate a large amount of heat. This heat sink is designed to provide better cooling than traditional fan- or liquid-cooled passive heatsinks.
The ATS-19E-05-C1-R0 is a special type of heatsink constructed of aluminum. Aluminum is one of the most widely used materials for thermal solutions because of its low cost, good thermal properties, and ease of fabrication. The ATS-19E-05-C1-R0 heat sink is designed with fins on the exterior of the aluminum base plate, which increases its area and facilitates the cooling process. The aluminum base plate provides a thermal path that takes the heat away from the heat source and transfers it to the fins.
The fins on the ATS-19E-05-C1-R0 are designed to provide the maximum possible airflow. This allows the heat sink to effectively dissipate heat by dissipating it into the surrounding air. The fins are also designed to be oriented perpendicular to the base plate to maximize their effectiveness. Additionally, the fin size and placement are used to optimize the amount of air flow to the sink, allowing it to cool faster and more effectively. Additionally, the design of the fins allows for air to flow in multiple directions, which increases the heat sink\'s efficiency.
The ATS-19E-05-C1-R0 is designed for use in a variety of applications and is capable of dissipating heat from electronic components in medical, automotive, industrial, and military applications. The heat sink is suitable for high-power applications, such as power electronics, and can withstand temperatures up to 140°C. In addition, the ATS-19E-05-C1-R0 is designed to be easy to install with mounting lugs to ensure it fits securely in place.
The ATS-19E-05-C1-R0 is an excellent choice for anyone looking for an effective, efficient, and reliable thermal solution for their electronic components. The heat sink\'s design allows it to cool quickly and effectively even in the most demanding applications. The aluminum construction ensures durability and strength, while the fins help to dissipate heat effectively, resulting in an overall improved performance. Additionally, the ATS-19E-05-C1-R0 is designed to be easy to install and maintain, making it a great choice for anyone looking for a reliable thermal solution.
The specific data is subject to PDF, and the above content is for reference