| Allicdata Part #: | ATS-19E-109-C3-R1-ND |
| Manufacturer Part#: |
ATS-19E-109-C3-R1 |
| Price: | $ 5.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X9.5MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19E-109-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.65003 |
| 30 +: | $ 4.39152 |
| 50 +: | $ 4.13318 |
| 100 +: | $ 3.87488 |
| 250 +: | $ 3.61655 |
| 500 +: | $ 3.35823 |
| 1000 +: | $ 3.29365 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to Thermal Heat Sinks
Thermal heat sinks are devices used to draw away and transfer heat away from components that generate heat, such as CPUs and other types of integrated circuits. The most common form of thermal heat sinks are metal-based, such as aluminum or copper, and shaped in a wide variety of flat-panel or radial-fin designs.
The heat-dissipating capabilities of the heat sinks can be enhanced by adding components such as fans or fan blowers or other active means of heat transfer. Heat sinks vary greatly in terms of their design and application and can be combined with fans, liquid cooling systems, and even Peltier coolers.
ATS-19E-109-C3-R1 Application Field and Working Principle
The ATS-19E-109-C3-R1 is a type of thermal – heat sink which is located on the underside of the mother board in a computer system’s chassis. The heat sink is designed to transfer heat away from the CPU in order to keep the system running at an optimal temperature and prevent overheating. The ATS-19E-109-C3-R1 is composed of an extruded aluminum core surrounded by aerodynamic fins.
The thermal transfer capabilities of the ATS-19E-109-C3-R1 are enhanced by the addition of a fan or fan blower in order to increase air circulation around the heat sink. With improved air circulation around the CPU, more heat can be dissipated from the CPU, thus improving the system’s performance. Additionally, the fan will also help reduce noise as it blows air across the heatsink and out of the case.
The ATS-19E-109-C3-R1 heat sink is designed to fit specific motherboards including models from Acer, Asus, Dell, and Toshiba. The installation of the ATS-19E-109-C3-R1 is considered to be relatively straightforward with most systems, as it requires only four screws and no other support hardware for the assembly.
Once installed, the ATS-19E-109-C3-R1 is able to transfer heat away from the CPU efficiently, maintaining an optimal temperature across the entire system and extending its lifetime. This makes it an ideal choice for those looking to maximize the performance of their computer. The ATS-19E-109-C3-R1 is a reliable and durable solution to cooling requirements, providing effective heat dissipation with minimal noise.
The specific data is subject to PDF, and the above content is for reference