| Allicdata Part #: | ATS-19E-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-19E-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19E-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sink
Heat sinks are an essential component of a thermoelectric cooling system that helps to regulate temperatures on electronic circuits. The ATS-19E-117-C1-R0 is a thermal-electrical heat sink designed for use in high performance electronics and control systems. It uses advanced thermal engineering to dissipate heat from the circuit. In this article, we will discuss the application field and working principle of the ATS-19E-117-C1-R0 heating sink.
Application Field
The ATS-19E-117-C1-R0 heat sink is particularly well-suited for high power circuit boards, microprocessors, and other components in high performance applications, such as telecommunications, military systems, and industrial automation. It can be used to cool components in broadcast and studio equipment, medical imaging systems, and other applications that require higher thermal stability.
Working Principle
The ATS-19E-117-C1-R0 heat sink uses a combination of two cooling techniques: convection and conduction. The aluminum base of the heat sink is designed with fins that increase the surface area available for efficient heat transfer. Its design also incorporates an optimized air flow pattern to further enhance heat dissipation. The heat from the device is then dissipated through the fins of the heat sink.
The aluminum base of the heat sink is also layered with anodized black in order to absorb some of the heat. The anodized coating also helps to improve the thermal conductivity of the heat sink. As a result, the heat is quickly and efficiently dissipated to the environment.
Thermal grease or a thermal pad may also be applied to the surface of the heat sink in order to help further transfer heat to the fins. This will ensure maximum efficiency in heat dissipation.
Conclusion
The ATS-19E-117-C1-R0 heat sink is an effective thermal solution for high performance applications. Its unique combination of convection and conduction cooling, as well as its optimized air flow design, ensure maximum efficiency in dissipating heat from its surfaces. thermal grease or thermal pads can be applied to help even further increase the heat transfer rate to the environment.
The ATS-19E-117-C1-R0 heat sink is the perfect solution for any device needing to maintain optimal thermal stability.
The specific data is subject to PDF, and the above content is for reference