| Allicdata Part #: | ATS-19E-137-C3-R0-ND |
| Manufacturer Part#: |
ATS-19E-137-C3-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19E-137-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Thermal – Heat Sinks offer a highly efficient way of dissipating heat from electrical components in order to maintain reliable operation. The ATS-19E-137-C3-R0 is a thermal heat sink from ThermoFlo Technologies, designed specifically for applications that require efficient air cooling. With its unique design, this heat sink provides superior performance and reliability.
ATS-19E-137-C3-R0 Application Field
The ATS-19E-137-C3-R0 is designed to be used in a wide variety of applications, including high-performance CPUs, GPUs, and other high-powered components. Its versatile design allows it to be used in a variety of form factors, from high-end gaming desktops to workstation-class systems. Its versatility also makes it ideal for use in a wide array of small form factor systems, such as embedded computers, HTPCs, and mini-itx boards.
More specifically, the ATS-19E-137-C3-R0 is ideal for applications that are subject to extreme temperatures and require robust cooling solutions. Its unique design allows it to efficiently dissipate heat without producing excessive noise. Additionally, its superior thermal efficiency allows it to maintain low temperatures even under stressful conditions, making it ideal for critical applications.
ATS-19E-137-C3-R0 Working Principle
The ATS-19E-137-C3-R0 utilizes an air-to-air convection cooling system to dissipate heat generated by the component it is protecting. This type of cooling system is a highly efficient and reliable way to move heat away from the component. The heat generated by the component is transferred to the cooling system via a heat pipe or a vapor chamber which is then dissipated by the heat sink.
The ATS-19E-137-C3-R0 features a closed-loop, finned aluminum design which increases its efficiency. The finned aluminum design allows the heat to be efficiently and quickly dissipated from the heat pipes into the air, providing superior cooling performance. Additionally, the aluminum fins act as a reflector, reflecting the heat away from the component and out into the air.
The ATS-19E-137-C3-R0 also features an integrated airflow management system. This system provides an efficient airflow that ensures the maximum efficiency of the cooling system. It also reduces noise levels, making it suitable for applications where noise is an issue.
Conclusion
The ATS-19E-137-C3-R0 is a highly advanced thermal heat sink from ThermoFlo Technologies that provides superior performance and reliability in extreme thermal conditions. Its unique finned aluminum design provides superior cooling performance and efficient airflow management reduces noise levels. The ATS-19E-137-C3-R0 is an ideal choice for a wide variety of applications, from high-performance gaming desktops to embedded systems.
The specific data is subject to PDF, and the above content is for reference