ATS-19E-138-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19E-138-C1-R0-ND

Manufacturer Part#:

ATS-19E-138-C1-R0

Price: $ 3.08
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X15MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19E-138-C1-R0 datasheetATS-19E-138-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.77011
30 +: $ 2.69514
50 +: $ 2.54533
100 +: $ 2.39564
250 +: $ 2.24590
500 +: $ 2.17103
1000 +: $ 1.94643
Stock 1000Can Ship Immediately
$ 3.08
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.12°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management is a crucial part of any electronic device\'s design, and efficient thermal management is often the difference between a successful device and an unreliable one. Thermal-heat sinks are one of the most effective methods for efficient thermal management. ATS-19E-138-C1-R0 is a thermal-heat sink designed to improve the thermal performance of electronic devices. This article will discuss the application field and working principle of the ATS-19E-138-C1-R0.

The ATS-19E-138-C1-R0 is a high-performance thermal-heat sink designed for use in industrial, automotive, medical and military applications. The thermal-heat sink is designed to improve the efficiency of a wide range of electronic devices, including CPUs, GPUs, FPGAs, ASICs and other components. It has an effective thermal resistance of 0.41 °C/W and a maximum power dissipation of 70W. The thermal-heat sink has a 3-pin, 5 foot base and includes a variety of accessories, such as mounting clips, nuts and bolts, washers, and thermal pads.

The working principle of the ATS-19E-138-C1-R0 is simple but effective. The thermal-heat sink works by absorbing the heat produced by the electronic device and radiating it away. This is accomplished by a combination of convection and conduction, which are two forms of heat transfer. The convection process involves the circulation of air around the thermal-heat sink, while the conduction process involves the direct transfer of heat between the thermal-heat sink and the device. The thermal-heat sink is designed to dissipate the heat quickly and efficiently, ensuring that the electronic device remains cool and functioning properly.

The ATS-19E-138-C1-R0 offers a number of benefits over traditional cooling methods, such as improved efficiency and reliability. It is able to handle higher power levels than traditional cooling methods, making it ideal for high-performance applications. The thermal-heat sink is also easy to install and can be used in a variety of electronic devices, from TV tuners to cell phone processors, without any additional components. In addition, the thermal-heat sink is small and lightweight, making it easy to transport and store.

Overall, the ATS-19E-138-C1-R0 is a highly effective thermal-heat sink designed to improve the thermal performance of electronic devices. It is designed for use in a wide range of applications and offers improved efficiency and reliability. The thermal-heat sink is easy to install and can be used in a variety of electronic devices. Its small size and lightweight design make it easy to transport and store, making it an ideal choice for any thermal-management project.

The specific data is subject to PDF, and the above content is for reference

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