| Allicdata Part #: | ATS-19E-143-C1-R0-ND |
| Manufacturer Part#: |
ATS-19E-143-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19E-143-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are used in a variety of electronics with a range of applications including cooling processors or high-powered LEDs and lasers. To meet the demands of today’s modern electronics, and the need to dissipate heat efficiently, engineers often require high performance thermal solutions. The ATS-19E-143-C1-R0 heat sink is capable of providing an efficient and reliable cooling solution for many different thermal systems.
The ATS-19E-143-C1-R0 is a thermal heat sink constructed from an extruded aluminum heat spreader, an exposed copper plate, and an array of louvers that provide up to 50 unrestricted air flow paths. The copper plate provides excellent thermal performance for direct component cooling, and the louver array reduces air resistance across the entire surface of the heat sink, dramatically increasing the thermal efficiency of the system.
The copper surface area of the heat sink is composed of two alternating dimensions, a flat surface, and an enlarged surface, which helps to improve the heat dissipation of the overall design. The elongated footprint of the heat sink spreads the heat generated from components mounted across a larger surface, allowing for a more effective heat dissipation. Also included is a 00-BGA mounting pattern designed to install fast, as well as providing a stable base and direct component contact.
In addition to superior thermal performance, the ATS-19E-143-C1-R0 offers a slim profile and excellent pressure compatibility. On top of that, the heat sink offers excellent corrosion resistance and a low contact thermal resistance range of 0.11°C/W. The ATS-19E-143-C1-R0’s efficient air flow design allows it to be used in a variety of applications, including in-board components, backplanes, and power supplies.
The ATS-19E-143-C1-R0 heat sink is an ideal solution for electronic devices that require a reliable and efficient heat dissipation system. It provides superior thermal performance and is easy to install, making it an ideal choice for thermal solutions in a wide range of electronics applications.
The specific data is subject to PDF, and the above content is for reference