| Allicdata Part #: | ATS-19E-170-C3-R0-ND |
| Manufacturer Part#: |
ATS-19E-170-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19E-170-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-19E-170-C3-R0 thermal heat sink is designed to efficiently dissipate heat from sensitive electrical components, such as processors and other sensitive high-powered components. Overall, this product offers an efficient and cost-effective solution for managing heat within an enclosed electronic system. This article will discuss the application field and working principle of the ATS-19E-170-C3-R0.
Applications
The ATS-19E-170-C3-R0 is designed to provide fast and economical cooling for high powered electronic components in a range of applications. It is suitable for use in a range of industries, such as computers, telecommunications, medical equipment, and even automotive applications. It is suitable for use with components such as processors, voltage regulators, chokes, and FETs. Additionally, it is designed to provide reliable cooling in applications with limited space or tight installation constraints.
The thermal heat sink is highly efficient due to its large surface area. This large surface area helps to dissipate the generated heat rapidly and effectively. Additionally, the thermal heat sink is designed to fit perfectly with the components that require heat dissipation, making it an effective and reliable cooling solution.
Working Principle
The working principle of the thermal heat sink is relatively simple. The large surface area enables the heat generated by the components to be dissipated more effectively. The heat is dissipated by transferring it to the air surrounding the sink. The thermal properties of the material also allow heat to be absorbed and stored, rather than immediately dissipated.
The heat is then dissipated through convection; air from the surrounding environment is drawn into the device, absorbs the heat, and is released. This helps to lower the temperature of the heated components and increases their operational performance. Additionally, the thermal heat sink ensures the components are kept within an optimal operating temperature range.
Conclusion
The ATS-19E-170-C3-R0 thermal heat sink provides an efficient and cost-effective solution for cooling high powered electronic components. It is suitable for a wide range of applications and offers reliable heat dissipation. The thermal heat sink operates according to the simple principle of convection, drawing in air from the surrounding environment and transferring heat to it. This reduces heat accumulation within the system and keeps all components within the ideal operating temperature range, thus increasing their performance.
The specific data is subject to PDF, and the above content is for reference