| Allicdata Part #: | ATS-19E-37-C3-R0-ND |
| Manufacturer Part#: |
ATS-19E-37-C3-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19E-37-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are key elements in maintaining the quality of many essential components in our everyday lives. The ATS-19E-37-C3-R0 is a simple but effective heat sink that is used to reduce heat buildup and dissipate it efficiently. This is a passive device, meaning it does not require any external power and operates independently. The ATS-19E-37-C3-R0 heat sink is often used in industrial, commercial and residential applications.
In the field of electronics, heat sinks are primarily used to protect components from overheating, especially during sustained use. Heat buildup can be dangerous and result in component failure if not properly managed. Heat sinks are designed to absorb the thermal energy from components and dissipate it into the external environment. This is done through a combination of convection, thermal radiation, and conduction. The ATS-19E-37-C3-R0 heat sink is an example of an advanced heat sink designed to drain heated energy efficiently while also protecting against component breakdown.
The ATS-19E-37-C3-R0 heat sink works by using a combination of convection, thermal radiation, and conduction to move thermal energy away from components. The device is designed with an inverted surface, which acts as a barrier to dissipate heat outward by convection. This surface is also shaped to allow thermal radiation from the components to be transferred outward efficiently, reducing heat buildup within the components. In addition, the sink is designed to have good thermal conductivity, which allows it to move heat away from the components faster through the device\'s material.
This heat sink also contains built-in fins, which help to increase the surface area for the transfer of thermal energy. These fins are designed to dissipate heat away from the components faster and maintain a comfortable temperature within the system. The design of the ATS-19E-37-C3-R0 also ensures that it is easy to mount onto the device and fits correctly.
The ATS-19E-37-C3-R0 heat sink is a highly efficient device for managing the thermal energy produced by components in a wide range of applications. It is an important tool for ensuring components are kept in working order and outperforming its competitors by efficiently dissipating thermal energy. As the device does not require any external power, it can be used in a variety of applications without additional power sources. This makes the ATS-19E-37-C3-R0 an ideal choice for cost-effective thermal management.
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