
Allicdata Part #: | ATS-19E-55-C1-R0-ND |
Manufacturer Part#: |
ATS-19E-55-C1-R0 |
Price: | $ 3.21 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X10MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 2.92446 |
30 +: | $ 2.84550 |
50 +: | $ 2.68733 |
100 +: | $ 2.52926 |
250 +: | $ 2.37119 |
500 +: | $ 2.29216 |
1000 +: | $ 2.05503 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 23.94°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-19E-55-C1-R0 Thermal-Heat Sink is a compact heat-concentrating device designed to help improve air circulation in dusty and challenging environments. It can efficiently draw and dissipate heat away from a system that would normally be contained within a space, resulting in improved reliability and performance. This device utilizes a passive thermal management solution, using the heat transfer properties of air thermodynamics to circulate warm air away from critical components. Furthermore, the ATS-19E-55-C1-R0 can be used in applications where a traditional fan solution would have been employed.
The fundamental idea behind this device’s functionality lies in its heat sink design. A metal sink, or cooling fin, absorbs heat from its surroundings and uses conductive heat transfer to disperse it away. The device features a circular heat sink that comes with a high-grade aluminum base for faster heat transfer and better cooling performance. The fins are designed to be highly efficient, while their spacing also allows for optimum airflow to balance out the heat. Additionally, a specifically formulated thermal pad is also included as a means of providing an even better balance of thermal and mechanical design.
This heat sink can be used to cool a wide range of electronics and components, including CPUs and GPUs. It utilizes an optimized, self-contained fin structure that allows it to draw heat away from a component more quickly than other devices. It also has a wide range of operating temperatures, ensuring that it can effectively cool components in a variety of challenging environments. Furthermore, the ATS-19E-55-C1-R0 is also designed to be compatible with most mounting hardware solutions.
In addition, the device also features a unique air circulator design. This feature helps direct cool air to the system’s core, meaning that less air is needed to achieve efficient cooling. The air circulator also helps to reduce the amount of dust and debris that build up on the device, ensuring that it remains clean and efficient even in the most hostile environments.
Overall, the ATS-19E-55-C1-R0 Thermal-Heat Sink is an essential device for anyone looking to improve their system’s performance. The device’s compact design allows it to be easily installed in confined spaces, while its highly efficient thermal and mechanical design ensures that it can handle even the toughest of challenges. Moreover, it is also incredibly easy to maintain, making it an excellent solution for any application.
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