ATS-19E-57-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.13°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-19E-57-C1-R0 Thermal - Heat Sinks Application Field and Working Principle

Thermal-Heat-Sinks are components that are used mainly in electronics to move heat away from sensitive components and out into the environment. The transfer of heat is accomplished with metal fins and an aluminum heat sink. In most cases, a fan is added to blow cool air over the fins to increase the convection of heat out of the heat sink.ATS-19E-57-C1-R0 is a Thermal - Heat Sinks developed and produced by CECO ENCLOSURES. It applies high quality aluminum alloy material and is anodized for environmental protection. A copper heat pipe is installed inside to ensure faster heat transfer. And the heat sink comes with pre-applied thermal pad and fans to cool the system for longer operation life.The working principle of Thermal - Heat Sinks is quite simple. Heat from the device or component is conducted to the heat sink where it is spread out over the extended surfaces. The extended surfaces take much of the heat allowing the device to operatle cooler and the dissipated heat then passes from the heat sink into the atmosphere. The larger the surface area of the heat sink, the better it functions for dissipating heat away from the device or component. So the Thermal -Heat Sinks have an essential role in electronics today.Various Thermal - Heat Sinks are used in a variety of electronic devices, from simple gaming consoles and computers to complex industrial control systems. ATS-19E-57-C1-R0 can also be used in a variety of applications, such as scientific instruments, medical equipment, automotive electronics, etc. In fact, most electric devices or components need a thermal solution for heat dissipation, and ATS-19E-57-C1-R0 is an ideal choice for its great features, including but not limited to its high quality aluminum alloy material, anodized surface, pre-applied thermal pad, copper heat pipe, and fan to help exchange heat more quickly.ATS-19E-57-C1-R0 is an ultra-thin heat sink that can easily be mounted onto any application. It is designed to provide efficient and effective cooling. The fins and copper heat pipes help transfer heat away from the source to the fins, increasing its margin of safety. The anodized aluminum housing is dense and lightweight, and also serves as a heat sink. In addition, the fan helps ensure that the air flow is optimized around the device and helps achieve maximum heat dissipation from the heat sink.In summary, ATS-19E-57-C1-R0 is a high-performance Thermal - Heat Sinks designed to cool down electronics devices and components. It features high-quality aluminum alloy material, an anodized surface, pre-applied thermal pad, copper heat pipe, and fan. It provides effective and efficient cooling by increasing surface area of the heat sink for increased heat dissipation. ATS-19E-57-C1-R0 is ideal for a variety of electronics applications and is sure to help ensure longer operation life for the device or component.

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