| Allicdata Part #: | ATS-19E-72-C3-R0-ND |
| Manufacturer Part#: |
ATS-19E-72-C3-R0 |
| Price: | $ 5.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19E-72-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.63806 |
| 30 +: | $ 4.38060 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks: ATS-19E-72-C3-R0 application field and working principle
A thermal-heat sink (THS) device serves to interface electronic components to a heat sink that transfers heat away from a device and allows the device to operate normally. In this article, I will examine the application field and working principle of a particular thermal-heat sink device, the ATS-19E-72-C3-R0.
Application Field
The ATS-19E-72-C3-R0 thermal-heat sink is a high-performance device designed to effectively dissipate heat generated by electronic devices that operate at high temperatures. It is especially useful in applications such as power amplifiers, laser diodes, and high power LED lighting. The device is also ideal for electronic devices that are expected to work continuously in harsh and hostile environments, such as in the outdoors or on aircraft and spacecraft.
Working Principle
The primary purpose of the thermal-heat sink is to transfer the heat away from the device in question and into the ambient air. To achieve this, the device employs a combination of thermal mass and low-temperature-transfer materials. The device is composed of a thermoelectric module, which is made up of two plates that contain a heat transfer material on one side. This material acts as a bridge between the two plates, allowing heat to pass from one plate to the other. The material has a high thermal conductivity, ensuring that heat transfer is efficient and effective.
The other component of the device is the heat sink. This is a metal plate with a large array of fins that help to dissipate heat into the atmosphere. The fins increase the surface area exposed to the air, which in turn increases the rate at which heat can be removed from the device. The heat sink is attached to the thermoelectric module and works in conjunction with it, allowing heat to be transferred out of the device and into the atmosphere.
The ATS-19E-72-C3-R0 thermal-heat sink offers improved cooling performance over other traditional heat sink devices. It is able to operate in a wide range of temperatures, from -10°C to +100°C, and can handle a wide variety of voltages and currents. The device is also designed to be highly reliable and durable, and has a long life expectancy, making it an excellent choice for applications in which long-term reliability and performance are paramount.
Conclusion
The ATS-19E-72-C3-R0 thermal-heat sink is a high-performance device that is designed to effectively dissipate heat generated by electronic devices. It is especially useful in applications in which long-term reliability and performance are paramount. The device is composed of a thermoelectric module and a heat sink, which work together to transfer the heat away from the device and into the ambient air. The device is highly reliable and durable, with a long life expectancy, and is able to operate in a wide range of temperatures, from -10°C to +100°C.
The specific data is subject to PDF, and the above content is for reference