| Allicdata Part #: | ATS32116-ND |
| Manufacturer Part#: |
ATS-19E-73-C2-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19E-73-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.13740 |
| 10 +: | $ 3.05550 |
| 25 +: | $ 2.97259 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.85°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The thermal-heat sink ATS-19E-73-C2-R0 is an efficient heat transfer device designed to dissipate large amounts of heat from electrical components. It is commonly used in thermal management applications such as power supplies, HVAC systems, LED lighting, and other industrial and consumer electronic devices.
The ATS-19E-73-C2-R0 has a unique construction which makes it ideal for drawing heat away from chips, circuit boards, and other components with small or confined spaces. It consists of four layers consisting of a base, an aluminum heat sink, a copper heat spreader, and a detachable radiator. The base layer functions as the main platform that all other components are mounted to and acts as a thermal conductor to transfer the heat to the other layers. The aluminum heat sink absorbs the heat from the base layer and disperses it throughout the unit. The copper heat spreader then further increases the surface area of the heat sink allowing for more efficient heat transfer. Finally, the detachable radiator transfers the heat away from the unit and out into the surrounding environment.
The ATS-19E-73-C2-R0 can be used to supplement existing cooling systems, reduce temperatures of components, and to extend the lifespan of electrical systems by reducing heat build-up. The unit incorporates multiple features such as airflow fins, grooves, and copper heat pipes that ensure effective heat dissipation.
The ATS-19E-73-C2-R0 is most widely used in the industrial, consumer electronics, and computing industries. It is commonly utilized for cooling processors, graphics cards, and other components that produce significant amounts of heat. The unit is also used in computers and other electronic devices to reduce the temperatures and extend the life of these components. Additionally, it can be used to cool industrial machinery and large-scale electronic equipment.
The ATS-19E-73-C2-R0 works by effectively transferring heat away from components and out into the surrounding environment. Heat is first drawn out of the component into the heat sink where it is absorbed and then transferred away via the internal heat pipes and fins. The fins then dissipate the heat out into the air, allowing for efficient cooling of components.
The ATS-19E-73-C2-R0 is an efficient thermal solution designed to reduce temperatures and extend the lifespan of components. Its unique construction and features provide effective heat dissipation and can be used in a variety of applications. With its durable construction and reliable performance, the ATS-19E-73-C2-R0 provides an effective solution to temperature management.
The specific data is subject to PDF, and the above content is for reference