ATS-19F-04-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-19F-04-C1-R0-ND

Manufacturer Part#:

ATS-19F-04-C1-R0

Price: $ 3.37
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19F-04-C1-R0 datasheetATS-19F-04-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.05550
30 +: $ 2.97276
50 +: $ 2.80753
100 +: $ 2.64235
250 +: $ 2.47724
500 +: $ 2.39466
1000 +: $ 2.14693
Stock 1000Can Ship Immediately
$ 3.37
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.55°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a key factor in a variety of applications and one of the most important elements for ensuring the optimal performance of the system. Heat sinks are one type of thermal management, and ATS - 19F - 04 - C1 - R0 is an advanced heat sink designed for a variety of applications.

The ATS - 19F - 04 - C1 - R0 heat sink is designed for use in a wide variety of applications including automotive, industrial and medical applications, where high thermal performance and long life are required. The heat sink features a compact design that is optimized for maximum thermal efficiency. The heat sink consists of an aluminum case, with an epoxy-based thermal pad at the base of the package to ensure that heat is transferred efficiently from the component to the heat sink. The heat sink has a streamlined shape that allows for efficient cooling.

The ATS - 19F - 04 - C1 - R0 is designed to provide effective heat dissipation in a wide range of operating environments, and is ideal for applications with high ambient temperatures or high-power components. The heat sink is designed to be mounted on existing surfaces, with mounting holes provided to ensure easy installation. The heat sink also features internal fins that help to reduce the overall thermal resistance, and increase the efficiency of the heat sink.

The ATS - 19F - 04 - C1 - R0 heat sink features an optimized internal construction designed to improve thermal performance, with a fin design that allows air to pass freely between the heat sink and the component. The heat sink also features a high-efficiency fan that helps to cool the heat sink and allow it to operate at cooler temperatures.

The ATS - 19F - 04 - C1 - R0 is designed to meet a variety of thermal control requirements, including high-power components, high ambient temperatures, and long-term operation. It is an ideal solution for applications that require reliable, efficient thermal management solutions. It is designed to offer high performance, long life, and a low overall cost of ownership.

The ATS - 19F - 04 - C1 - R0 has been designed to reduce power consumption while maximizing the thermal performance. Its low profile design allows it to fit in tight spaces and still maintain the required performance levels. In addition, the ATS - 19F - 04 - C1 - R0 is designed to be efficient in operation and easy to install.

The ATS - 19F - 04 - C1 - R0 heat sink is a great solution for any application that needs efficient thermal management. Its advanced features make it an ideal choice for a variety of applications, from automotive and industrial applications to medical and consumer electronics. Whether you need a heat sink that offers high thermal performance, long life, or a low total cost of ownership, the ATS - 19F - 04 - C1 - R0 is an ideal solution.

The specific data is subject to PDF, and the above content is for reference

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