ATS-19F-04-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-19F-04-C3-R0-ND

Manufacturer Part#:

ATS-19F-04-C3-R0

Price: $ 3.75
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-19F-04-C3-R0 datasheetATS-19F-04-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.41208
30 +: $ 3.31968
50 +: $ 3.13526
100 +: $ 2.95079
250 +: $ 2.76641
500 +: $ 2.67419
1000 +: $ 2.39754
Stock 1000Can Ship Immediately
$ 3.75
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks play an important role in the efficient functioning of thermal management systems and dissipate heat from sources such as electrical components. The ATS-19F-04-C3-R0 is a specific type of heat sink from the ATS series which is designed for applications in various industries. This heat sink has numerous features and benefits that make it ideal for applications such as energy storage, industrial and medical equipment, and computing and hardware.

The ATS-19F-04-C3-R0 heat sink features a variety of different materials which offer superior thermal performance. Its lightweight morphology and thin films also make it suitable for industrial applications which require more compact and diffusion-ready designs. The heat sink is manufactured from a combination of aluminum, copper, and tin alloys, which allows for enhanced mechanical strength and durable performance.

This heat sink also comes with a variety of mounting and attachment options, which enables it to be easily adapted for use in different applications. The heat sink can be mounted through pin-in-hole, bolt-and-nut, clamping, or snap-in-place methods. The optional standoff and aluminum fins further increase heat dissipation and reduce its footprint.

Furthermore, the ATS-19F-04-C3-R0 is designed with a high degree of accuracy for reliable, consistent performance. Its stringent quality control processes and continual testing offer reliable performance and ensure the heat sink operates consistently within its specified operating parameters.

The ATS-19F-04-C3-R0 heat sink’s working principle is based on the thermal conduction process. It uses the thermal conductivity of certain metals to transfer heat from electronic components to its surface. The heat is then dissipated into the environment through natural convection and/or forced convection. The heat sink also makes use of additional features such as cooling airflows, fins, and heat pipes to enhance the cooling effect and further boost performance.

The ATS-19F-04-C3-R0 heat sink is a perfect choice for a wide range of applications which require superior thermal management. Its efficient working principle and reliable performance make it an ideal choice for numerous industries. It is also capable of providing enhanced levels of performance and durability even in the most demanding conditions.

The specific data is subject to PDF, and the above content is for reference

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