| Allicdata Part #: | ATS32152-ND |
| Manufacturer Part#: |
ATS-19F-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks connected to electrical components, such as computers, are designed to disperse heat away from those components in order to prevent the components from overheating. ATS-19F-10-C2-R0 is an aluminum heat sink designed to absorb and dissipate thermal energy produced by electronic components. It is designed to optimize the performance of an electronic circuit by reducing the operating temperature of the electronic components.
The ATS-19F-10-C2-R0 is a low profile, highly efficient passive heatsink made of high performance extruded aluminum alloy. The fins have been designed with evenly spaced ridges to increase heat transfer while also preserving the integrity of the material. The entire assembly is assembled with stainless steel hardware to ensure long-lasting performance. Its mounting design allows for easy installation on through-hole components, allowing for quick assembly and installation onto a motherboard.
The principle at work in the ATS-19F-10-C2-R0 is conduction. Heat absorbed from the component is transferred to the aluminum fins by conduction. As the heat passes through the fins, air passing over the fins disperses the heat away from the component, cooling it to an optimal temperature. In addition to conduction, the design of the fins ensure that convection is also at work. The heat is now absorbed by the air passing over the fins, allowing it to flow away and dissipate while also further cooling the component.
The ATS-19F-10-C2-R0 is designed as a “drop-in” thermal solution, allowing for easy and quick installation. When installed, the thermal fins will provide a significant increase in the surface area, allowing for increased heat dissipation and a much higher reliability and performance. Along with the “drop-in” solution, the design also ensures that any air turbulence produced by the fan will be kept to a minimum. This is done by enclosing the fan in a specially designed box, which ensures that the air is drawn in from the sides instead of the top, which keeps the air moving in a laminar pattern instead of a turbulent one.
The ATS-19F-10-C2-R0 is designed for use in high-end applications where efficient and reliable thermal management solutions are mandatory. While this thermal solution may provide a good thermal performance, it should be noted that the application must be considered when selecting a heat sink. A good thermal solution should have a low profile, good air flow, and be designed for the specific chassis and components being used.
The specific data is subject to PDF, and the above content is for reference