| Allicdata Part #: | ATS-19F-105-C1-R1-ND |
| Manufacturer Part#: |
ATS-19F-105-C1-R1 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X40X9.5MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-19F-105-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a vital requirement for most electronic systems. Electronic systems must produce reliable, predictable results even at extreme temperatures. Heat sinks have been used in the past to help dissipate heat away from electronics, but new advances in technology have allowed for new solutions to perform more efficiently and with more flexibility. The ATS-19F-105-C1-R1 is one of these new solutions.
The ATS-19F-105-C1-R1 is a unique heat sink solution. It is a high efficiency fin heat sink, making it suitable for use in a variety of applications ranging from telecommunications to power supplies. The ATS-19F-105-C1-R1 has an innovative three-layer design which enables it to act as an effective heat spreader, allowing for uniform and efficient heat dissipation. This design also minimizes the amount of air resistance on the fins, increasing the efficiency of heat dissipation.
The ATS-19F-105-C1-R1 also features a unique fin cross-section design. The fins are designed in a way that allows for greater heat dissipation and thermal control. This design enables the ATS-19F-105-C1-R1 to transfer heat away from electronics more efficiently and with better uniformity than traditional heat sinks.
The main application field of the ATS-19F-105-C1-R1 is in power supplies. The design of the ATS-19F-105-C1-R1 heat sink allows for superior heat dissipation, which helps to ensure that the power supply unit remains at a temperature that is suitable for operation. The ATS-19F-105-C1-R1 also helps to protect the sensitive electronics in the power supply from potential damage caused by overheating.
The ATS-19F-105-C1-R1 also has applications in other areas. It is suitable for use in communications systems, providing a reliable and efficient way of dissipating heat away from electronic components. It can also be used in computers and other electronic systems, helping to ensure maximum efficiency and reliability.
The working principle of the ATS-19F-105-C1-R1 is fairly simple. The heat produced by the electronics in the system is transferred to the heat sink through thermal conduction. This heat is then dissipated away from the electronics and into the surrounding environment. This process helps to ensure that the electronics remain at a safe temperature and do not overheat.
The ATS-19F-105-C1-R1 is a highly effective and reliable heat sink solution. It is suitable for use in a wide range of applications and provides an efficient way of dissipating heat away from electronic components. Its innovative design ensures that it offers superior thermal management, and its simple working principle ensures that it can be used with ease in almost any system.
The specific data is subject to PDF, and the above content is for reference